Spindle Damping Assembly With Tunable Natural Frequency
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Solution Overview
Problem
Vibrations in the spindle of a grinder used to thin wafers can weaken the cohesive strength of the wafers, making it difficult to achieve precise thickness reduction.
Innovation Solution
A damping apparatus is integrated into the grinder, comprising a plurality of weights, dampers, springs, and pressurizing modules. The dampers attenuate vibrations between lower weights, while the springs are arranged between upper weights, with pressurizing modules controlling the total spring constant to manage the natural frequency of the damping apparatus.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a grinder is used to reduce wafer thickness, then wafer thinning is achieved, but spindle vibration weakens wafer cohesive strength
Solution Approach 1:
The invention converts the harmful vibration energy into beneficial damping effects by using viscous dampers that dissipate vibrational energy through fluid resistance, and by using spring elements that store and release vibrational energy, thereby reducing the negative impact of spindle vibration on wafer cohesive strength while maintaining the grinding function
Solution Approach 2:
The invention applies damping elements (viscous dampers and springs) to the spindle assembly before the grinding operation occurs, providing pre-cushioning that attenuates vibrations during the grinding process, thereby protecting the wafer from vibration-induced weakening of cohesive strength before damage can occur
2Productivity
If spindle vibration occurs during grinding, then grinding operation continues, but vibration acts as uncontrollable factor for vertical movement
Solution Approach 1:
The invention implements a feedback mechanism where the damping elements continuously respond to spindle vibrations in real-time, detecting vibration patterns and automatically adjusting damping forces to maintain precise vertical movement control throughout the grinding operation, ensuring both productivity and precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The damping apparatus effectively attenuates spindle vibrations, thereby enhancing the cohesive strength of the wafers and improving the precision of wafer thickness reduction.
Implementation Method 1
The plurality of the dampers may be arranged between adjacent lower weights among the plurality of the weights to attenuate a vibration of the spindle
Implementation Method 2
The plurality of the springs may be arranged between adjacent upper weights among the plurality of the weights
Data Source
AI summary
A damping apparatus may include a plurality of weights, a plurality of dampers, a plurality of springs and a plurality of pressurizing modules. The plurality of the weights may be connected to a spindle. The plurality of the dampers may be arranged between adjacent lower weights among the plurality of the weights to attenuate a vibration of the spindle. The plurality of the springs may be arranged between adjacent upper weights among the plurality of the weights. The plurality of the pressurizing modules may be configured to selectively connect each of the springs with adjacent upper weights. Thus, a natural frequency of the damping apparatus may be controlled to effectively attenuate the vibration of the spindle.