High-Density Spinel Ceramic for Plasma-Resistant Etch Chambers
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Solution Overview
Problem
Semiconductor manufacturing processes face challenges with plasma etch and clean processes that cause erosion of equipment surfaces, leading to contamination and reduced component lifespan due to the corrosive nature of plasma, necessitating materials with superior plasma resistance while maintaining mechanical, electrical, and thermal properties.
Innovation Solution
A ceramic article with a spinel (MgAl2O4) structure is developed, manufactured using a spark plasma sintering process, achieving a density greater than 99.5% of the theoretical density, which provides excellent plasma erosion resistance, mechanical, electrical, and thermal properties, and reduces particle generation and metal contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional materials are used for chamber liners and apparatus components, then manufacturing cost and ease of manufacture are maintained, but plasma erosion resistance deteriorates leading to reduced component life and increased contamination
Solution Approach 1:
The patent employs a composite structure consisting of a ceramic liner layer (e.g., aluminum oxide, aluminum nitride, or silicon carbide) deposited on a metal substrate. This composite material combines the plasma erosion resistance of ceramics with the mechanical strength and thermal conductivity of metals, resolving the contradiction between plasma resistance and manufacturability.
Solution Approach 2:
The ceramic liner acts as an intermediary protective layer between the plasma environment and the metal apparatus components. This intermediate layer shields the underlying metal structure from direct plasma exposure, providing erosion resistance while allowing the metal substrate to maintain structural integrity and facilitate manufacturing.
2Duration of action of stationary object
If material selection prioritizes plasma resistance, then component life is extended and contamination is reduced, but mechanical, electrical and thermal properties may deteriorate
Solution Approach 1:
The composite structure of ceramic liner on metal substrate leverages the complementary properties of both materials: the ceramic provides plasma erosion resistance and extended component life, while the metal substrate contributes mechanical strength, toughness, and thermal conductivity, thus maintaining overall mechanical properties while improving durability.
Solution Approach 2:
The ceramic coating is applied locally only to the surfaces exposed to plasma, providing plasma resistance where needed, while the bulk metal substrate maintains the mechanical properties required for structural support. This localized application of different material properties resolves the contradiction between plasma resistance and mechanical strength.
3Object-generated harmful factors
If ceramic materials are used to resist plasma erosion, then particle generation and metal contamination are reduced, but mechanical strength and toughness may deteriorate
Solution Approach 1:
The composite structure combines ceramic and metal materials, where the ceramic layer reduces particle generation and metal contamination by protecting against plasma erosion, while the metal substrate provides the necessary mechanical strength and toughness that pure ceramics lack.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The high-density spinel ceramic article significantly enhances the lifespan of semiconductor manufacturing equipment by minimizing plasma-induced erosion and contamination, while maintaining superior mechanical and thermal performance.
Implementation Method 1
manufactured using a spark plasma sintering process
Implementation Method 2
heating the green body to a sintering temperature; applying an electrical pulse to the green body
Implementation Method 3
provides excellent plasma erosion resistance; The plasma may be highly corrosive, and may corrode processing chambers and other surfaces that are exposed to the plasma
Data Source
AI summary
A ceramic article includes a ceramic body including a spinel (MgAl2O4) structure, wherein a ratio of a density of the spinel structure to a theoretical density of a spinel is greater than 99.5%. A semiconductor apparatus for manufacturing a semiconductor structure includes a ceramic article including a spinel (MgAl2O4) structure, wherein a ratio of a density of the spinel structure to a theoretical density of a spinel is greater than 99.5%. A method of manufacturing a ceramic article includes providing a green body; heating the green body to a sintering temperature; compressing the green body; applying a electrical pulse to the green body; and forming a ceramic body including a spinel (MgAl2O4) structure after heating, compressing and applying the electrical pulse to the green body.