Spinel Dielectric Assembly for Adhesive-Free Ferrite Composites
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Solution Overview
Problem
The conventional process for manufacturing composite magnetic-dielectric disc assemblies is inefficient due to the need for machining, adhesive application, and curing, which complicates the assembly and integration of components in high-frequency applications like circulators and isolators.
Innovation Solution
The method involves co-firing pre-sintered magnetic and green articles with a specific oxide ratio, forming a non-magnetic spinel-structured oxide that allows for adhesive-free assembly of composite articles with a dielectric constant between 7 and 14, enabling the integration of components without adhesives and improving magnetization and performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional machining and adhesive assembly processes are used, then precise dimensions and component attachment are achieved, but assembly time and process complexity increase
Solution Approach 1:
The patent combines multiple separate operations (machining, adhesive application, curing) into a single co-firing process where the dielectric and magnetic components are attached through simultaneous thermal processing, eliminating sequential steps and reducing total assembly time
Solution Approach 2:
The patent extracts and eliminates the adhesive material from the assembly process, replacing chemical bonding with direct thermal bonding through co-firing, thereby removing the need for adhesive application and curing steps
2Reliability
If multiple processing steps (machining, adhesive application, curing) are used, then component attachment is achieved, but process complexity increases
Solution Approach 1:
The patent merges multiple discrete process steps into a single integrated co-firing operation, reducing the number of process transitions and handling operations, thereby simplifying the overall manufacturing workflow while maintaining reliable component attachment
3Strength
If adhesive materials are used for assembly, then component attachment is achieved, but additional materials and processing steps are required
Solution Approach 1:
The patent removes adhesive materials from the assembly process entirely, replacing chemical bonding with direct thermal bonding through co-firing, which eliminates the need for separate adhesive application and curing operations
Solution Approach 2:
The co-firing process enables the components to bond to each other through direct thermal interaction during sintering, with the dielectric and magnetic materials themselves providing the bonding mechanism without requiring external adhesive materials
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces assembly time and enhances the performance of microstrip circulators and isolators by allowing for uniform magnetization and integration of components on a single substrate, improving miniaturization and reducing insertion loss, making them suitable for 5G and high-frequency applications.
Implementation Method 1
fired in a kiln (commonly referred to simply as 'firing')
Implementation Method 2
forming a non-magnetic spinel-structured oxide that allows for adhesive-free assembly
Data Source
AI summary
The disclosed technology generally relates dielectric materials, and more particularly to a combination of co-fireable dielectric materials that can be attached to each other without the use of adhesives. In an aspect, a composite article comprises a magnetic portion comprising a nickel zinc ferrite. The composite article additionally comprises a non-magnetic portion contacting the magnetic portion, the non-magnetic portion comprising a spinel-structured oxide comprising Mg2-xAl2xTi1-xO4 and having a dielectric constant between about 7 and 14, wherein 0<x≤1.