Spinel Particles Thermal Conductivity via Crystallite Diameter

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Solution Overview

Problem

Conventional spinel particles are not used as inorganic fillers due to their lower thermal conductivity compared to alumina, limiting their application in electric devices where high thermal conductive properties are required.

Innovation Solution

Increasing the crystallite diameter of spinel particles, particularly the [111] plane, to 220 nm or more, enhances their thermal conductivity, making them suitable for use as inorganic fillers in electric devices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If spinel particles are used as inorganic fillers, then cost is reduced, but thermal conductivity is insufficient

Engineering Contradiction:

ImprovecostVSAvoidthermal conductivity

Core Design Contradiction:

Ease of manufactureVSTemperature

Solution Approach 1:

The invention changes the crystallite diameter parameter of spinel particles from conventional small sizes to 220 nm or more in the [111] plane. This parameter change transforms spinel from a low thermal conductivity material into one with thermal conductivity comparable to or exceeding alumina, while maintaining cost advantages

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention creates a composite structure within the spinel particle by controlling the crystallite structure at the nanoscale while maintaining overall particle integrity. The specific crystallite orientation and size create a composite-like thermal conduction pathway that enhances overall thermal conductivity

Inventive Principle:

Principle #40Composite materials

2Ease of manufacture

If conventional spinel particles are used, then material cost is lower, but heat dissipation performance is insufficient

Engineering Contradiction:

Improvematerial costVSAvoidheat dissipation performance

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

By changing the crystallite diameter parameter to 220 nm or more in the [111] plane, the invention achieves heat dissipation performance comparable to alumina while using cost-effective spinel material, thus improving reliability without sacrificing cost efficiency

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The modified spinel particles exhibit excellent thermal conductive properties, surpassing those of alumina, enabling improved heat dissipation in electric devices and reducing their size and weight while maintaining performance.

Implementation Method 1

spinel particles having excellent thermal conductive properties

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11040887B2Spinel particles, method for producing same and composition and molded article including spinel particles

Publication Date: 2021.06.22 DIC CORP

AI summary

Alumina is generally used as an inorganic filler, while spinel, which is known to be lower in thermal conductivity than alumina, is used in applications such as gems, fluorescence emitters, catalyst carriers, adsorbents, photocatalysts and heat-resistant insulating materials, but not expected to be used as a thermally conductive inorganic filler. Thus, an object of the invention is to provide spinel particles having excellent thermal conductive properties. The invention relates to a spinel particle including magnesium, aluminum and oxygen atoms and molybdenum and having a [111] plane crystallite diameter of 220 nm or more.