Spintronic Magnetic Pillar Fabrication for Thick Active Layers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing manufacturing methods for spintronic devices with thick magnetic layers face challenges in achieving resolutions below 30 nm, leading to issues such as electrical short-circuits and complex pillar structures due to angular dispersion during deposition, which complicates the production of arrays with thick magnetic layers.
Innovation Solution
A method involving the deposition of a sacrificial layer, formation of flared cavities, and controlled planarization to create magnetic pillars, followed by deposition of non-magnetic spacers and reference layers, ensuring self-aligned layer deposition and avoiding electrical contact, using techniques like damascene and dual damascene processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional deposition methods are used for thick magnetic layers, then material can be deposited, but angular dispersion causes electrical short-circuits and manufacturing defects
Solution Approach 1:
The patent applies preliminary action by forming flared cavities in the sacrificial layer before depositing the thick magnetic layer. The flared shape (wider at the top than the bottom) is created in advance to pre-compensate for the angular dispersion of deposited material. This preliminary structural preparation ensures that material deposited at angles will land within the cavity boundaries rather than causing short-circuits between adjacent pillars.
Solution Approach 2:
The patent uses a sacrificial layer as an intermediary structure. This temporary layer is deposited first, then patterned with flared cavities, and finally removed after the magnetic layer is formed. The sacrificial layer mediates the deposition process by providing the flared cavity template that controls material placement, eliminating the need for complex real-time deposition control.
2Manufacturing precision
If flared cavity structures are used to prevent short-circuits, then manufacturing precision improves, but device structure becomes more complex
Solution Approach 1:
The patent extracts the complexity from the final device structure by using a sacrificial layer that is completely removed after serving its purpose. The flared cavity complexity exists only temporarily during manufacturing in the sacrificial layer, then is entirely taken out when the sacrificial material is removed. The final magnetic pillar structure is simple and straightforward, without any flared features.
Solution Approach 2:
The flared cavity structure is applied as a preliminary manufacturing aid rather than a permanent feature. The complexity is introduced temporarily in the sacrificial layer to enable precise pillar formation, then eliminated. This preliminary action allows simple final structures to be manufactured with high precision.
3Stability of the object's composition
If thick magnetic layers are deposited to improve thermal stability, then device performance improves, but deposition control becomes more difficult
Solution Approach 1:
The flared cavity structure is prepared in advance in the sacrificial layer to pre-defin the deposition boundaries. This preliminary geometric constraint allows thick magnetic layers to be deposited with controlled lateral dimensions, even though the layer thickness is large. The flared walls guide the deposited material and prevent it from spreading beyond the intended pillar footprint.
Solution Approach 2:
The patent changes the geometric parameters of the deposition mold (the sacrificial layer cavities) by creating flared shapes with specific angle ranges (30-60 degrees). This parameter change in the cavity geometry compensates for the angular dispersion of thick layer deposition, allowing precise control of the final magnetic pillar dimensions despite the thickness of the layer being deposited.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the controlled manufacturing of spintronic devices with thick magnetic layers, reducing electrical short-circuits and simplifying the production process, enabling devices with improved thermal stability and scalability.
Implementation Method 1
The method comprises depositing at least one sacrificial layer
Implementation Method 2
forming at least one flared cavity, traversing said sacrificial layer
Implementation Method 3
depositing at least one magnetic layer in said cavity
Data Source
AI summary
A method for manufacturing a spintronic device including a non-magnetic spacer, a reference layer and a storage layer including a magnetic pillar, the method including depositing at least one sacrificial layer; forming at least one flared cavity, traversing the sacrificial layer; depositing at least one magnetic layer in the cavity; eliminating the excess of magnetic layer outside of the cavity; removing the dielectric layer in order to form at least one magnetic pillar forming all or part of the storage layer; depositing at least the non-magnetic spacer and the reference layer; filling the spaces between the magnetic pillars with a dielectric material; carrying out a polishing; forming an electrical contact on the surface of the element surmounting the magnetic pillar.