Archimedean Spiral Bonding Substrates for Thermal Expansion Misalignment
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Solution Overview
Problem
In the electronic industry, bonding substrates with different thermal expansion coefficients often results in misalignment due to varying expansion rates, leading to poor bonding precision in flexible display devices.
Innovation Solution
A substrate with Archimedean spiral-shaped bonding portions allows for precise alignment and adjustment by rotating one substrate relative to the other, ensuring accurate bonding despite thermal expansion differences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional bonding methods are used for substrates with different thermal expansion coefficients, then bonding process is simple, but misalignment occurs due to thermal expansion differences
Solution Approach 1:
The bonding portion is designed with an Archimedean spiral curved shape instead of a straight line. This curved geometry allows the bonding structure to accommodate thermal expansion differences between substrates by distributing stress along the spiral path, preventing misalignment while maintaining bonding effectiveness.
Solution Approach 2:
The bonding portion is designed to be rotatable relative to the bottom plate, allowing dynamic adjustment during the bonding process. This rotational capability enables real-time alignment correction to compensate for thermal expansion mismatches between substrates with different expansion coefficients.
2Adaptability or versatility
If substrates with different thermal expansion coefficients are bonded, then functional integration is achieved, but misalignment occurs during bonding
Solution Approach 1:
The Archimedean spiral curved shape of the bonding portion accommodates thermal expansion differences between dissimilar substrates by distributing mechanical stress along the curved path, enabling reliable bonding of substrates with different thermal expansion coefficients without misalignment.
Solution Approach 2:
The bonding portion is designed with rotational freedom around the vertical axis, adding a rotational degree of freedom to the bonding interface. This allows alignment adjustment in the rotational dimension to compensate for thermal expansion mismatches, enabling versatile substrate integration.
3Manufacturing precision
If Archimedean spiral-shaped bonding portions are used, then alignment precision is improved, but manufacturing complexity increases
Solution Approach 1:
The Archimedean spiral pattern can be efficiently manufactured using standard photolithography and etching processes commonly available in semiconductor fabrication. The curved geometry is defined by simple mathematical equations that can be directly translated into manufacturing masks, making the complex shape easy to produce.
Solution Approach 2:
The bonding portion is designed as a separate layer or component that can be pre-fabricated and then attached to the bottom plate. This segmentation allows the complex spiral shape to be manufactured independently using optimized processes, then integrated into the final device, reducing overall manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves alignment and bonding precision by accounting for thermal expansion discrepancies, enhancing the reliability and yield of electronic devices.
Implementation Method 1
it is easy to cause misalignment during bonding due to different thermal expansion coefficients of different materials
Data Source
AI summary
A substrate is provided. The substrate includes a bottom plate and at least one bonding portion disposed on the bottom plate, where each bonding portion takes a shape that is a part of an Archimedean spiral. An electronic device, a bonding structure, and a bonding method for the bonding structure are further provided.