Spiral Coil Inductor Mechanical Support Structure
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic devices with spiral-shaped coils longitudinally spaced from each other face issues with mechanical strength and impact resistance, which affect their inductor properties.
Innovation Solution
The electronic device includes a substrate with a first spiral coil, a second spiral coil spaced above the first, and connection portions that electrically and mechanically couple them, with the second coil being mechanically connected to the substrate's outer side face to enhance mechanical strength and impact resistance, and include insulators to reduce eddy-current loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If spiral-shaped coils are longitudinally spaced from each other to achieve high Q value, then inductor performance is improved, but mechanical strength and impact resistance of the upper layer coil deteriorate
Solution Approach 1:
A support structure is introduced as an intermediary element between the first coil and the second coil. This support structure provides mechanical support to the second coil, improving its mechanical strength and impact resistance, while maintaining the longitudinal spacing between coils that enables high Q value inductor performance.
Solution Approach 2:
The inductor structure combines multiple materials with different properties: the coil windings (conductive material), the support structure (mechanically strong material), and the substrate (insulating and mechanically stable material). This composite approach allows simultaneous optimization of electrical performance (Q value) and mechanical properties (strength and impact resistance).
2Reliability
If spiral-shaped coils are longitudinally spaced from each other to achieve high Q value, then inductor performance is improved, but impact resistance of the upper layer coil deteriorates
Solution Approach 1:
The support structure acts as a mediator that absorbs and distributes impact forces on the second coil, protecting it from damage while maintaining the required longitudinal spacing for high Q value operation.
Solution Approach 2:
The support structure provides beforehand cushioning by being positioned to receive and dissipate impact forces before they can damage the second coil, thus improving impact resistance while preserving the inductor's electrical performance characteristics.
3Strength
If connection portions are added to mechanically connect coils to substrate, then mechanical strength is improved, but eddy-current loss increases and Q value decreases
Solution Approach 1:
The support structure is designed with local quality differentiation: it provides mechanical connection and strength where needed, while incorporating insulating characteristics in regions where eddy currents could form. This allows mechanical strength to be improved without significantly increasing eddy-current loss.
Solution Approach 2:
The design converts the potential harmful effect of connection portions (which could create eddy current paths) into a benefit by using the support structure to provide mechanical strength while its insulating properties actually reduce eddy-current loss compared to fully conductive connections.
Data Source
AI summary
An electronic device includes a substrate, a first coil that has a spiral shape and is provided on the substrate, a second coil that has a spiral shape, is provided above the first coil, and is spaced from the first coil, a first connection portion that electrically couples the first coil and the second coil, a wire that is provided on the substrate and connects one of the first coil and the second coil to outside, and a second connection portion that is mechanically connected to an outer side face of outermost circumference of the second coil and is mechanically connected on the substrate where one of the wire and the first coil is not provided.