Spiral Discharge Paths for Bubble-Free Semiconductor Encapsulation
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Solution Overview
Problem
Existing semiconductor device encapsulation methods often result in uneven filling of encapsulation members, leading to bubble generation and encapsulation failures due to the linear arrangement of discharge paths around the region containing semiconductor elements and wires.
Innovation Solution
The semiconductor device incorporates a case with multiple through holes, each equipped with an injection port and a spiral arrangement of discharge paths surrounding the region, ensuring even distribution and flow of the encapsulation member to prevent bubble formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If two through holes with linearly juxtaposed discharge paths are used to encapsulate the region, then the encapsulation structure is simple, but the region tends to be unevenly filled and bubbles may generate
Solution Approach 1:
The invention divides the discharge path into multiple segments arranged in a circular pattern around the region to be encapsulated. Instead of using a single linear discharge path, multiple discharge paths are distributed circumferentially, which segments the flow of encapsulation member and ensures more uniform distribution throughout the region, preventing bubble formation while maintaining structural simplicity.
Solution Approach 2:
The invention employs a circular arrangement of discharge paths around the region to be encapsulated, transitioning from a linear configuration to a curved/circular one. This circular geometry allows the encapsulation member to flow evenly from all directions around the region, achieving uniform filling and eliminating the unevenness caused by linear juxtaposed paths.
2Manufacturing precision
If multiple discharge paths are provided to surround the region, then filling uniformity is improved, but the device complexity increases
Solution Approach 1:
The invention combines multiple discharge paths into a single integrated circular structure that surrounds the region. Rather than treating each discharge path as a separate complex component, they are merged into a unified circular arrangement that achieves uniform filling while maintaining overall structural simplicity and ease of manufacturing.
Data Source
AI summary
A semiconductor device includes a case surrounding a region that contains semiconductor elements and wires. The case is provided with s(an integer greater than k and equal to or greater than three)-pieces of discharge paths for discharging an encapsulation member to the region. The s-pieces of discharge paths are provided so as to surround the region as seen in a plan view. The s-pieces of discharge paths are spirally provided as seen in a plan view.