Spiral Distribution Body for Uniform Electroplating
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Solution Overview
Problem
Achieving uniform electroplating on rotating substrates with reduced artefacts and defect-patterns is challenging due to the difficulty in maintaining consistent electrolyte flow and current density distribution, especially as electronic device geometries shrink and become more complex.
Innovation Solution
A distribution system with openings arranged in a spiral pattern on the distribution body ensures uniform exposure of electrolyte flow and current density across the substrate, using various spiral geometries like Archimedean, logarithmic, parabolic, or square root spirals to maintain consistent plating over the substrate surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a high density of electrolyte jets and current density distribution elements are arranged to align with substrate surface elements, then manufacturing precision of uniform plating is improved, but device complexity increases and rotational artefacts are created
Solution Approach 1:
The patent applies asymmetry by transitioning from symmetric rectangular grid patterns to asymmetric spiral patterns for arranging electrolyte jets and current density distribution elements. The spiral arrangement (Archimedean, logarithmic, parabolic, or square root spirals) creates non-uniform angular distribution that eliminates rotational artifacts while maintaining coverage, resolving the contradiction between plating uniformity and rotational pattern formation.
Solution Approach 2:
The patent employs curvature by replacing straight-line rectangular arrangements with curved spiral trajectories. The spiral patterns (particularly logarithmic and Archimedean spirals) provide continuous curvature that ensures uniform radial and angular distribution of process fluid and current density, achieving defect-free plating without the rotational artifacts inherent in linear geometric patterns.
2Adaptability or versatility
If the substrate surface elements are shrunk to smaller dimensions, then adaptability to electronic device geometries is improved, but manufacturing precision of aligned distribution elements becomes impossible
Solution Approach 1:
The patent applies parameter changes by transitioning from fixed geometric spacing to mathematically defined spiral parameterizations. The spiral patterns are defined by equations (Archimedean: r=a+bθ, logarithmic: r=ae^kθ, parabolic: r=a√θ, square root: r=a√θ) that automatically adapt to different substrate scales and geometries, maintaining uniform distribution regardless of substrate element size or pattern complexity.
Solution Approach 2:
The patent moves from two-dimensional rectangular grid arrangements to spiral trajectories that effectively utilize polar coordinates (radial and angular dimensions). This dimensional transformation allows continuous coverage and uniform distribution that adapts to any substrate geometry or scale without requiring precise alignment of discrete elements, solving the manufacturing precision limitation.
3Ease of manufacture
If geometric arrangements of electrolyte jets are limited to manufacturable sizes, then ease of manufacture is improved, but rotational artefacts are created on rotating substrates
Solution Approach 1:
The patent uses asymmetric spiral patterns that are inherently manufacturable (using standard drilling or laser machining) but create non-uniform angular distribution. The spiral arrangement ensures that as the substrate rotates, each point receives uniform exposure from the distributed jets, eliminating rotational artifacts while maintaining ease of manufacture through simple radial drilling from a central point.
Solution Approach 2:
The patent applies periodic action through the rotational symmetry inherent in spiral patterns. The spiral arrangement creates multiple equivalent positions around the substrate that are activated periodically during rotation, ensuring uniform time-averaged exposure. This periodic activation pattern eliminates rotational artifacts while maintaining simple manufacturable geometry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for uniform electroplating with reduced rotational artefacts and defect-patterns, improving deposition uniformity without complex mechanical implementations, and is adaptable to different substrate geometries and positions.
Implementation Method 1
The process solution flowing back from the substrate is led off through connecting passages to the rear face of the flow distributor body. At the same time, a targeted distribution of an electrical field towards a readily prepared substrate surface is effected by a specific arrangement of the connecting passages.
Implementation Method 2
The electric current distribution from the electrolyte is directed from an anode through the HSP plate towards the substrate surface (acting as the cathode).
Implementation Method 3
Chemical and/or electrolytic surface treatment like electroless and electrochemical or electrolytic deposition is frequently used for surface coating of planar, as well as non-planar, patterned, non-metallic as well as metallic and/or metallized surfaces.
Data Source
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AI summary
The disclosure relates to a distribution system for a process fluid for chemical and/or electrolytic surface treatment of a rotatable substrate, an electrochemical deposition system for a chemical and/or electrolytic surface treatment of a substrate and a method for a chemical and/or electrolytic surface treatment of a substrate in a process fluid. The distribution system comprises a distribution body. The distribution body comprises a plurality of openings for the process fluid. The openings are arranged in a spiral-shaped pattern on a surface of the distribution body.