Spiral Epoxy Tape Preform Assembly for Clean Resin Infusion
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Solution Overview
Problem
Existing methods for assembling composite components, such as fibre-reinforced resin components, are time-consuming and inefficient due to mechanical connections and uncontrolled application of spray-on adhesives, leading to resin contamination issues during resin transfer moulding.
Innovation Solution
A double-sided tape with a backing layer and an epoxy resin layer, where the resin layer is applied in a spiral pattern, allowing selective adhesion and easy removal of the backing layer, is used to attach reinforcement pieces before resin infusion, ensuring precise application and compatibility with the resin transfer process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If mechanical connection (sewing or stapling) is used to attach pieces together, then the pieces can be securely connected, but the process becomes time-consuming and increases fabrication cost
Solution Approach 1:
The patent replaces mechanical connection methods (sewing, stapling) with a chemical adhesive system. A tape carrying a layer of adhesive material is applied to the reinforcement pieces, eliminating the need for mechanical fasteners. This substitution of mechanical systems with chemical bonding achieves both strong connections and improved assembly efficiency.
2Strength
If spray-on adhesive is applied to attach pieces, then attachment can be achieved, but the adhesive application is uncontrolled leading to resin contamination during moulding
Solution Approach 1:
The patent segments the adhesive application process by using a tape with discrete adhesive layers positioned at specific locations on the reinforcement pieces. Instead of spraying adhesive over entire surfaces, the adhesive is confined to specific zones where it is needed, providing controlled application and preventing contamination of the moulding resin.
Solution Approach 2:
The tape acts as an intermediary carrier that delivers the adhesive material precisely to the required locations. The tape structure includes a backing layer with adhesive layers at specific positions, serving as a mediating element between the adhesive material and the reinforcement pieces, ensuring controlled and precise application.
3Strength
If excessive adhesive is applied to pieces, then strong attachment is achieved, but too much adhesive contaminates the resin injected into the mould during resin transfer moulding
Solution Approach 1:
The patent applies adhesive material only at specific local positions on the reinforcement pieces rather than uniformly across entire surfaces. The tape structure places adhesive layers at predetermined locations where attachment is required, providing local quality enhancement without excessive adhesive application that would contaminate the moulding resin.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The tape enables efficient, cost-effective assembly of composite components by reducing wastage and resin contamination, maintaining interlaminar shear strength, and ensuring uniform resin distribution during moulding.
Implementation Method 1
an epoxy resin layer adhered to a first surface of the backing layer, the first surface providing a first level of adherence to the epoxy resin layer
Data Source
AI summary
A tape comprising: a backing layer; and an epoxy resin layer adhered to a first surface of the backing layer in a spiral pattern, the first surface providing a first level of adherence to the epoxy resin layer so that when the epoxy resin layer is applied to a surface the backing layer can be removed from the epoxy resin layer.