Spiral Heat Shield Structure for Low-Conduction Substrate Heating
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Solution Overview
Problem
Conventional heat shield members used in substrate processing apparatuses suffer from reduced heat shielding effectiveness due to thermal conduction through supports, leading to increased material costs and potential temperature uniformity issues.
Innovation Solution
A heat shield member with a spiral portion formed by spirally winding a plate-like body, eliminating the need for supports and reducing thermal conduction, thereby enhancing the heat shielding effect.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional heat shield members are used with supports, then structural stability is provided, but thermal conduction through supports reduces heat shielding effectiveness
Solution Approach 1:
The invention removes the support structure from the heat shield member, extracting the source of thermal conduction. The plate-like body is suspended without supports, eliminating the harmful thermal pathway while maintaining the heat shielding function through radiant heat blocking alone.
Solution Approach 2:
The heat shield member uses a thin plate-like body that functions as a radiant heat barrier without requiring structural supports. The plate is designed to be thin yet sufficient for heat radiation blocking, eliminating the need for thick supporting structures that would conduct heat.
2Reliability
If heat shield member thickness is increased to improve heat shielding, then material quantity increases, but this leads to higher costs and potential temperature uniformity issues
Solution Approach 1:
The invention changes the functional approach from relying on material thickness to blocking heat to using a thin plate that blocks radiant heat through its surface properties. This parameter change allows effective heat shielding with minimal material quantity.
Solution Approach 2:
The heat shield member is designed as a thin, simple plate-like structure that achieves heat shielding without expensive or excessive material usage. The design prioritizes functional effectiveness over material quantity, using minimal material to achieve the desired heat blocking performance.
3Stability of the object's composition
If supports are added to heat shield member, then structural stability is improved, but device complexity and thermal conduction increase
Solution Approach 1:
The invention extracts and removes the support structure from the heat shield member design. By eliminating supports entirely, the design achieves simplicity while maintaining functional stability through the plate's inherent rigidity and positioning.
Solution Approach 2:
Instead of adding supports to achieve stability, the invention inverts the approach by removing supports and relying on the plate-like body's own structural properties and positioning to maintain stability. This inverted design reduces complexity while preserving essential function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat shield member achieves a higher heat shielding effect with reduced material thickness, improved temperature uniformity, and increased efficiency in attenuating radiant heat.
Implementation Method 1
a spiral portion (4) formed by spirally winding a plate-like body (2, 3) so as to have a surface of the plate-like body overlapped at intervals in multiple layers
Implementation Method 2
eliminating the need for supports and reducing thermal conduction
Data Source
AI summary
A heat shield member for shielding heat includes: a spiral portion formed by spirally winding a plate-like body to have a surface of the plate-like body overlapped at intervals in multiple layers.