Spiral Light Beam Wafer Inspection Depth Determination

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Solution Overview

Problem

Current wafer inspection systems face difficulties in accurately differentiating between defects near the surface and those closer to the focal plane, as the intensity of defects can be influenced by both depth and type, leading to ambiguous depth determination.

Innovation Solution

A computer-based apparatus using a spiral light beam with a phase filter characterized by Gauss-Laguerre Eigen modes, optimized to generate a spiral light beam with a rotational speed greater than 2.0, which enables precise adjustment of the wafer position through an electronic feedback loop to maintain intensity thresholds, allowing for accurate defect depth calculation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If conventional optical inspection with non-spiral light is used, then the inspection system is simple and easy to operate, but the depth determination accuracy is poor and cannot differentiate between surface and deeper defects

Engineering Contradiction:
Improvedepth determination accuracyVSAvoidoptical system complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent changes the fundamental parameter of light by using spiral light beams with orbital angular momentum instead of conventional non-spiral light. This parameter change enables the light to interact differently with defects at various depths, creating distinct intensity patterns that allow accurate depth determination while maintaining system functionality

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent introduces a spiral light beam as an intermediary between the light source and the defect detection process. The spiral light beam carries orbital angular momentum that interacts with defects at different depths, serving as a mediator that enables depth discrimination without requiring complex mechanical adjustments or multiple sensors

Inventive Principle:
Principle #24Intermediary (Mediator)

2Measurement precision

If light intensity is used to estimate defect depth, then the measurement process is simple, but the depth estimation is ambiguous and influenced by defect type rather than just depth

Engineering Contradiction:
Improvedepth estimation accuracyVSAvoiddepth information ambiguity
Core Design Contradiction:
Measurement precisionVSLoss of information

Solution Approach 1:

The patent changes the light parameter to spiral light with orbital angular momentum, which creates a different interaction mechanism with defects. This parameter change transforms the intensity measurement from being ambiguous (influenced by both depth and defect type) to being depth-specific, as the spiral light's rotational characteristics provide additional depth-sensitive information

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

Instead of trying to extract depth information from conventional light intensity patterns (which is ambiguous), the patent inverts the approach by using spiral light whose inherent rotational properties naturally encode depth information in the intensity patterns, making depth the primary determinant of intensity rather than a secondary effect

Inventive Principle:
Principle #13The other way round (Inversion)

3Measurement precision

If spiral light beam with low rotational speed is used, then the system is easier to implement, but the sensitivity and accuracy of defect depth determination is reduced

Engineering Contradiction:
Improvedefect depth determination accuracyVSAvoidspiral light beam rotational speed
Core Design Contradiction:
Measurement precisionVSSpeed

Solution Approach 1:

The patent optimizes the rotational speed parameter of the spiral light beam by selecting specific orbital angular momentum values that maximize the sensitivity of intensity variations to depth changes. This parameter optimization ensures that the light rotates fast enough to create distinguishable intensity patterns for different depths while maintaining system implementability

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent replaces mechanical adjustment mechanisms with optical parameter control by using electronically controllable spiral light sources with optimized rotational characteristics. This substitution allows precise control of the effective rotational speed through optical design rather than mechanical movement, achieving high sensitivity without mechanical complexity

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances the accuracy and sensitivity of defect depth determination, enabling the differentiation between surface and deeper defects, and improves the detection of defects of interest (DOIs) by increasing the rotational speed of the spiral light beam, thus overcoming the limitations of existing methods.

Implementation Method 1

a first light beam rotating in a first spiral about a first central axis

Methodology Applied
Scientific EffectSpiral light beam rotation: Angular Momentum

Implementation Method 2

A phase filter generating a spiral light beam with increased rotational speed

Methodology Applied
Scientific EffectPhase filtering: Filter (optical)

Data Source

PatentUS9989479B1System and method to determine depth for optical wafer inspection
Publication Date: 2018.06.05 KLA CORP
  • US9989479B1 patent drawing
  • US9989479B1 patent drawing
  • US9989479B1 patent drawing

AI summary

A computer-based apparatus for adjusting an auto-focus in a wafer inspection system, including: a wafer adjustment system; and an electronic feedback loop system configured to compare an intensity of a first light beam rotating in a first spiral about a first central axis, and when the intensity is less than a preselected threshold, adjust, using the wafer adjustment system, a position of the wafer until the intensity reaches the preselected threshold.