Spiral Path Guiding Member for Semiconductor Vacuum By-Product Capture
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Solution Overview
Problem
The semiconductor manufacturing process faces challenges in managing volatile by-products such as ammonium chloride and hydrogen chloride, which condense into fine powders, leading to increased maintenance costs due to frequent cleaning and replacement of equipment in the vacuum system.
Innovation Solution
An apparatus with a spiral path guiding member is used to control gas flow, diverting it in a spiral path to capture these by-products, reducing their accumulation and the need for frequent maintenance by facilitating their condensation and retention within a cold trap.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional linear flow path is used in vacuum system, then gas flow is simple and direct, but by-products accumulate on cold surfaces causing frequent maintenance
Solution Approach 1:
The patent applies a spiral flow path instead of a linear flow path, using curved surfaces to guide gas flow. The spiral geometry allows gas to follow a rotational path that prevents direct contact with cold surfaces while still enabling effective by-product capture, thus resolving the contradiction between flow simplicity and by-product accumulation.
Solution Approach 2:
The invention transitions from a one-dimensional linear flow path to a three-dimensional spiral flow path. By adding rotational and vertical dimensions to the gas flow, the system increases the path length and surface area for by-product capture without significantly increasing the horizontal footprint, effectively reducing by-product accumulation while maintaining system compactness.
2Object-generated harmful factors
If frequent cleaning and replacement of vacuum system components is performed, then by-product accumulation is reduced, but maintenance cost and production downtime increase
Solution Approach 1:
The spiral flow path design preliminarily captures by-products as they are generated during the deposition process, preventing them from reaching and accumulating on cold surfaces like vacuum pumps and valves. This proactive approach eliminates the need for frequent maintenance interventions, thereby reducing production downtime and maintenance costs.
3Object-generated harmful factors
If spiral path guiding member with multiple guiding plates is used, then by-products are effectively captured, but device complexity increases
Solution Approach 1:
The spiral flow path is achieved by segmenting the gas flow control into multiple guiding plates arranged in spiral sections. Each guiding plate acts as an individual flow direction control element, and together they form the complete spiral path. This segmentation allows for easier manufacturing and assembly while maintaining effective by-product capture capability.
Solution Approach 2:
The guiding plates serve multiple functions: they define the spiral flow path, guide gas flow direction, and facilitate by-product capture. By making these components multi-functional, the system achieves effective by-products capture without proportionally increasing device complexity, as the same structural elements perform multiple roles.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces production downtime and maintenance costs by efficiently capturing and retaining by-products, improving the operational efficiency of the semiconductor manufacturing process.
Implementation Method 1
The spiral path guiding member comprises at least two groups of guiding plates... Guiding plate openings of the guiding plates may facilitate gas to flow in a spiral flow path
Implementation Method 2
By-products, for example, ammonium chloride (NH4Cl) may leave the process furnace in vapor form but readily condense to fine powder that will accumulate in any cold surface of the vacuum system
Data Source
AI summary
An apparatus for controlling a flow of gas comprises a spiral path guiding member. The spiral path guiding member comprises at least two groups of guiding plates. Each guiding plate of each group is disposed in an axial direction to form a longitudinal axis. Each group is spaced apart in the longitudinal direction. A surface of each guiding plate is substantially parallel to the longitudinal axis. At least one guiding plate of each group has a guiding plate opening. Guiding plate openings of the guiding plates may facilitate gas to flow in a spiral flow path.