Spiral PECVD Chamber Layout to Prevent Substrate Recontamination
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Solution Overview
Problem
The substrate in PECVD processes is prone to secondary contamination during cleaning and spin-drying, affecting the film deposition effect due to exposure to particulate matter in the environment.
Innovation Solution
A PECVD apparatus with a spiral conveyor system that integrates cleaning, spin-drying, and deposition chambers, utilizing a spiral conveyor device and specialized spin-drying mechanisms to maintain a controlled environment and prevent contamination, ensuring substrates undergo cleaning, spin-drying, and deposition within the apparatus.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the substrate is cleaned and spin-dried outside the PECVD apparatus before deposition, then the cleaning and spin-drying operations can be performed, but the substrate is prone to secondary contamination by particulate matter in the environment
Solution Approach 1:
The patent combines cleaning, spin-drying, and deposition operations into a single integrated PECVD apparatus. The substrate remains within the apparatus throughout the entire process, with cleaning and spin-drying chambers connected to the deposition chamber, eliminating exposure to the external environment and preventing secondary contamination.
Solution Approach 2:
The patent implements a nested chamber structure where the cleaning chamber and spin-drying chamber are positioned within or adjacent to the deposition chamber. The substrate tray moves through nested transfer regions, allowing sequential operations while maintaining containment within the apparatus boundaries.
2Manufacturing precision
If the substrate is placed into the PECVD apparatus after cleaning and spin-drying, then the deposition can be performed, but the substrate is subject to secondary pollution from the external environment
Solution Approach 1:
The patent merges cleaning, spin-drying, and deposition into a single continuous process within one apparatus. The substrate never leaves the controlled environment of the PECVD apparatus, ensuring that the deposition surface remains free from secondary pollution while maintaining high manufacturing precision.
3Device complexity
If multiple chambers are arranged linearly for cleaning, spin-drying, and deposition, then the process sequence is simple, but the apparatus occupies more space and transfer time increases
Solution Approach 1:
The patent transitions from a linear one-dimensional arrangement to a two-dimensional or three-dimensional spatial configuration. Chambers are arranged in a compact layout with radial or multi-level positioning, allowing shorter transfer paths and reduced overall apparatus footprint while maintaining the sequential process flow.
Solution Approach 2:
The patent employs a spiral conveyor mechanism that follows a curved or helical path through the chambers. This spiral arrangement optimizes the transfer trajectory, allowing smooth transitions between chambers while minimizing transfer distance and time, thereby improving preparation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution prevents secondary contamination, enhancing the deposition effect and achieving high preparation efficiency by maintaining a controlled processing environment for substrates throughout the PECVD process.
Implementation Method 1
a spiral conveyor device is arranged in the transfer chamber, wherein the spiral conveyor device includes a conveyor rod, a spiral drive mechanism, and a plurality of conveyor assemblies; wherein the conveyor rod is vertically arranged in the transfer chamber, and the plurality of conveyor assemblies are spirally arranged on the conveyor rod
Implementation Method 2
a spin-drying device is arranged in the spin-drying chamber, wherein the spin-drying device includes a spin-drying support, and a support base, a lift mechanism, a plurality of clamp fingers, a connection rod, a rotation mechanism, and a jack mechanism
Implementation Method 3
PECVD is a commonly used semiconductor coating technology
Implementation Method 4
plasma enhanced chemical vapor deposition (PECVD) apparatus
Data Source
AI summary
A PECVD apparatus includes a transfer chamber, a load lock, a cleaning chamber, a spin-drying chamber, a deposition chamber, and an unload lock; wherein the load lock, the cleaning chamber, the spin-drying chamber, the deposition chamber, and the unload lock are successively spirally arranged on a side wall of the transfer chamber; and a spiral conveyor device is arranged in the transfer chamber, wherein the spiral conveyor device includes a conveyor rod, a spiral drive mechanism, and a plurality of conveyor assemblies; wherein the conveyor rod is vertically arranged in the transfer chamber, and the plurality of conveyor assemblies are spirally arranged on the conveyor rod, and wherein the spiral drive mechanism is configured to drive the conveyor rod to undergo a spiral ascending or descending movement.