Spiral Shape Memory Alloy Contact for Inclined Electrode Inspection
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Solution Overview
Problem
Existing electronic device inspection apparatuses face inefficiencies and inaccuracies due to contact failures when the electrode is not within a predetermined height range or is inclined, leading to interference and the need for frequent resets.
Innovation Solution
An electronic device inspection apparatus utilizing a shape memory alloy contact element with a spiral shape at one end, which changes to a flat shape upon temperature increase, allowing for efficient and accurate contact along the electrode face, even when the device is inclined.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If only the contact is moved close to the electrode, then the contact element can reach the electrode, but when the inspection target is inclined, peripheral portions of the electrode interfere and the contact cannot be brought into contact with the electrode
Solution Approach 1:
The contact element is designed with a spiral shape that allows it to expand in multiple directions simultaneously, not just linearly toward the electrode. This dimensional expansion enables the contact element to adapt to inclined surfaces and avoid peripheral interference, resolving the contradiction between reach distance and contact reliability.
Solution Approach 2:
The contact element utilizes shape memory alloy properties to dynamically change its configuration from a compact spiral at lower temperatures to an expanded flat shape at higher temperatures. This dynamic transformation allows the contact element to adapt its shape based on operational conditions, ensuring reliable contact even when the inspection target is inclined.
2Manufacturing precision
If the contact element is made rigid to maintain position, then positioning accuracy is improved, but it cannot adapt to height variations or inclination of the electrode
Solution Approach 1:
The contact element's physical parameters (shape, size, configuration) are changed through temperature-induced phase transformation of the shape memory alloy. This allows the contact element to transition between a compact state for precise positioning and an expanded state for adapting to electrode variations, resolving the contradiction between positioning accuracy and adaptability.
Solution Approach 2:
The contact element is made from shape memory alloy, a composite material that combines the properties of rigidity for positioning with the ability to undergo reversible phase transformation for adaptation. This material choice enables the contact element to maintain positioning accuracy while simultaneously adapting to electrode height variations and inclination.
3Reliability
If the contact element is moved actively to compensate for height variations, then contact is achieved, but the inspection efficiency is reduced due to frequent resets
Solution Approach 1:
The contact element is pre-configured with a spiral shape that is designed to expand into a flat configuration upon temperature increase. This preliminary configuration allows the contact element to automatically adapt to electrode variations without requiring active movement or reset operations, thereby maintaining both contact reliability and inspection efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and accurate inspection by forming a contact region along the electrode face, reducing interference and ensuring reliable electrical connections while minimizing damage to the electrode.
Implementation Method 1
at least one contact element formed of a shape memory alloy in a long and thin plate shape, one end side of the contact element being fixed to the holding mechanism, the other end side thereof being formed in a shape of a spiral at a first temperature and being developed from the spiral at a second temperature
Data Source
AI summary
An electronic device inspection apparatus of the present application comprises an inspection table for positioning and holding an electrode disposed on a semiconductor device, a contact element that is formed of a shape memory alloy in a long and thin plate shape and has a base part fixed to the inspection table and a variable part formed in a shape of a spiral at a first temperature and being developed from the spiral at a second temperature; and a measurement circuitry for measuring the semiconductor device by conducting a current to flow into the electrode via the contact element. The axis of the spiral of the variable part is parallel to the electrode face of the positioned electrode and a contact region is formed along a longitudinal direction between the variable part and the positioned electrode at the second temperature.


