Spliced Panel Substrate Layout for Stable Corner Wire Routing
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Solution Overview
Problem
Conventional methods for arranging wires on the lateral surfaces of display panels, such as silver paste silk transfer and photoresist stripping, result in peeling at corners, leading to thinner films and reduced yield rates.
Innovation Solution
A substrate design with a conductive layer on the front surface and a protective layer with contact holes, where conductive parts are stacked to form an overlapping surface with the lateral surface, allowing a second conductive layer to connect securely, and optionally including a third conductive layer on the back surface with thickened parts for enhanced stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If silver paste silk or photoresist are used to cover the lateral surface, then wire arrangement can be achieved, but the silver paste silk or photoresist at corners between the lateral surface and front surface would be peeled off, leading to thinner films and reduced yield rate
Solution Approach 1:
The patent transitions from a planar wire arrangement approach to a three-dimensional structure by forming conductive parts that extend vertically from the front surface through the protective layer to the lateral surface. This dimensional change allows wires to be arranged on the lateral surface without relying on surface-level materials that peel at corners, thereby improving yield rate while maintaining wire arrangement capability
Solution Approach 2:
The conductive parts are formed in advance within the protective layer before final wire placement. This preliminary formation of conductive structures embedded in the protective layer ensures that the wire arrangement foundation is stable and resistant to peeling, addressing the reliability issue before the actual wire arrangement process
2Reliability
If conventional wire arrangement methods are used on lateral surface, then wire connectivity can be established, but connection stability is reduced due to film thinning at corners
Solution Approach 1:
The conductive parts are nested within the protective layer, creating a protected conductive pathway that maintains uniform film thickness. The wires on the lateral surface connect to these nested conductive parts, ensuring stable connections without exposing the conductive material to corner peeling issues that cause thickness variation
Data Source
AI summary
A substrate, a manufacturing method thereof, and a spliced panel are disclosed. A base includes a front surface, a lateral surface, and a back surface. A first conductive layer is disposed on the front surface. The first conductive layer includes a first wire. A protective layer is disposed on the first conductive layer. A conductive part is correspondingly disposed in a contact hole and is connected to the first wire. The conductive part is stacked with the first wire to form an overlapping surface. A second conductive layer is disposed on the lateral surface of the base. The second conductive layer includes a second wire. The second wire is connected to the overlapping surface.