Splicing Backplane Asymmetry for Uniform Thickness

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Solution Overview

Problem

Large-size backlight modules pose challenges in punch forming and splicing due to size and weight, requiring complex and costly assembly processes that affect reliability and economy.

Innovation Solution

A splicing backplane design featuring a mounting portion and a supporting portion with stepped surfaces and reinforcing elements, allowing for easy assembly and superposition of multiple backplanes without altering overall thickness, and reinforced by horizontal and vertical supports for enhanced stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a monolithic backplane is used for large-size backlight modules, then structural strength is improved, but manufacturing complexity and cost increase due to requiring large-size punch forming molds

Engineering Contradiction:
Improvestructural strengthVSAvoidmanufacturing complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The backplane is divided into multiple standard-sized backplane units that can be independently manufactured using existing molds. These segmented units are then assembled together to form the complete backplane structure, eliminating the need for complex large-size punch forming molds while maintaining overall structural strength through the modular assembly approach.

Inventive Principle:
Principle #1Segmentation

2Adaptability or versatility

If multiple backplanes are spliced together, then assembly flexibility is improved, but structural stability deteriorates due to potential misalignment and deformation

Engineering Contradiction:
Improveassembly flexibilityVSAvoidstructural stability
Core Design Contradiction:
Adaptability or versatilityVSStability of the object's composition

Solution Approach 1:

The backplane units are designed with asymmetric stepped surfaces featuring different height differences on adjacent sides. This asymmetric design creates a unique interlocking geometry when backplanes are spliced together, ensuring proper alignment and preventing deformation while maintaining assembly flexibility. The asymmetric stepped surfaces guide the assembly process and ensure stable connections between multiple units.

Inventive Principle:
Principle #4Asymmetry

3Ease of operation

If stepped surfaces with equal height differences are used for splicing backplanes, then assembly simplicity is improved, but thickness uniformity deteriorates

Engineering Contradiction:
Improveassembly simplicityVSAvoidthickness uniformity
Core Design Contradiction:
Ease of operationVSManufacturing precision

Solution Approach 1:

The stepped surfaces are designed with asymmetric height differences where adjacent stepped surfaces have different heights. This asymmetric design ensures that when backplanes are spliced together, the varying height differences compensate for each other, maintaining uniform overall thickness while keeping the assembly process simple. The asymmetric stepped surfaces naturally guide alignment during assembly.

Inventive Principle:
Principle #4Asymmetry

4Strength

If reinforcing supports are added to splicing backplanes, then structural intensity is improved, but device complexity increases

Engineering Contradiction:
Improvestructural intensityVSAvoiddevice complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The reinforcing supports are integrated into the backplane structure itself, merging the support function with the existing backplane units. The reinforcing supports are designed as part of the modular assembly, combining multiple functions (structural support, alignment, and reinforcement) into a unified design that increases structural intensity without proportionally increasing device complexity.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS9411185B2Splicing backplane for backlight module and backlight module employing same
Publication Date: 2016.08.09 TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD
  • US9411185B2 patent drawing
  • US9411185B2 patent drawing
  • US9411185B2 patent drawing

AI summary

The invention provides a splicing backplane for a backlight module, which is arranged on the backside of the backlight module. The splicing backplane comprises a mounting portion and a supporting portion, wherein the horizontal height of the mounting portion is level with or lower than that of the supporting portion; and a plurality of the splicing backplanes are assembled together by the mutual superposition of various mounting portions. A plurality of the splicing backplanes are superposed with each other and combined into one, and the height differences between the mounting portions and the supporting portions of two adjacent backplanes are unequal, so that one backplane can be accommodated into the other backplane. In addition, after the superposition, the overall thickness of the backplanes is invariable.