Splicing Display Screen With Buried Driving ICs

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Solution Overview

Problem

Current display splicing technology faces issues with visible splicing gaps and poor driving display effects, leading to suboptimal performance in large-sized and special-shaped displays.

Innovation Solution

The proposed splicing display screen features sub-areas with buried driving ICs in grooves, connected via metal pads through via-holes, and series-connected IC rows/columns to a control unit, ensuring seamless splicing without thickness increase and protecting ICs from corrosion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If multiple display screens are spliced to achieve large-sized display, then the screen size is increased and manufacturing flexibility is improved, but visible splicing gaps appear and manufacturing precision deteriorates

Engineering Contradiction:
Improvedisplay screen sizeVSAvoidsplicing gap visibility
Core Design Contradiction:
Area of stationary objectVSManufacturing precision

Solution Approach 1:

The display system is divided into multiple independent display modules, each with its own driving IC. This segmentation allows flexible arrangement to achieve large-sized displays while maintaining manufacturing precision through standardized module interfaces that minimize visible gaps.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The driving IC is embedded within the display module structure, with the IC positioned in a recessed area of the module. This nesting approach integrates the driving component into the module itself, eliminating external connections that would create visible splicing gaps between modules.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Ease of manufacture

If driving ICs are exposed on the display surface, then electrical connection is simplified, but the ICs are exposed to corrosion and oxidation from water vapor

Engineering Contradiction:
Improveelectrical connection simplicityVSAvoidIC resistance to corrosion
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The driving IC is nested within a recessed cavity in the display module, completely enclosed by the module structure. This embedding protects the IC from direct exposure to water vapor and environmental factors while maintaining electrical connections through conductive vias that pass through the module layers.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The display module structure creates a protective environment around the driving IC, isolating it from corrosive water vapor. The encapsulation and sealing of the module effectively provide an inert barrier that prevents oxidation and corrosion of the IC components.

Inventive Principle:
Principle #39Inert atmosphere (Inert environment)

3Reliability

If driving ICs are arranged in series rows or columns, then IR Drop risk is reduced and display reliability is improved, but device complexity increases

Engineering Contradiction:
Improvedisplay performance stabilityVSAvoidIC connection structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The driving ICs are organized into segmented series rows or columns within the module array. This segmentation into structured groups simplifies the connection pattern while achieving reliable current distribution and reduced IR Drop through systematic series connections of multiple ICs.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS20240049546A1Splicing display screen
Publication Date: 2024.02.08 WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO LTD
  • US20240049546A1 patent drawing
  • US20240049546A1 patent drawing
  • US20240049546A1 patent drawing

AI summary

A splicing display screen defined with a plurality of sub-areas is provided. The splicing display screen includes a first substrate, a first metal layer, a plurality of driving ICs, a control unit, and a plurality of display screen units. The first metal layer is disposed on the first substrate, and each driving IC is buried in a groove of a corresponding sub-area and is electrically connected to a circuit of the first metal layer. The control unit is electrically connected to the plurality of driving ICs, and the plurality of display screen units correspond to the plurality of sub-areas in a one-to-one manner. The plurality of display screen units are disposed on the first metal layer and electrically connected to the first metal layer.