Split-Battery Headset Layout for Reduced Unit Thickness
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional headsets with a single large battery occupy significant internal space, making them thick and cumbersome, which is not conducive to wearing and use.
Innovation Solution
A headset design with two headset units, each containing a battery and a circuit board, arranged side by side in a radial direction, utilizing a gradient mounting space to reduce thickness and volume, and incorporating a speaker shell with angled mounting surfaces to optimize component placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Duration of action of moving object
If a single large battery is used to ensure sufficient capacity and long endurance, then the battery capacity is improved, but the headset unit thickness increases and internal space is occupied
Solution Approach 1:
The single large battery is segmented into two smaller batteries, with one battery installed in each headset unit. This segmentation allows the batteries to be arranged in a radial direction rather than stacked in the thickness direction, reducing headset unit thickness while maintaining sufficient total capacity for long endurance
Solution Approach 2:
The battery arrangement transitions from a vertical stacking layout (in the thickness direction) to a radial layout (in the radial direction of the headset unit). This dimensional change allows efficient space utilization and reduces the thickness of the headset unit while accommodating the battery capacity needed for long endurance
2Quantity of substance
If a single large battery is stacked with other electronic components inside the headset unit shell, then sufficient capacity is achieved, but the overall structure becomes thick and bulky
Solution Approach 1:
The single large battery is divided into two smaller batteries distributed across separate headset units. This segmentation eliminates the need for vertical stacking in the thickness direction, allowing components to be arranged radially and reducing overall headset unit thickness while maintaining adequate battery capacity
Solution Approach 2:
The component layout transitions from a thickness-direction stacking arrangement to a radial arrangement. This dimensional reorganization allows the battery and other electronic components to be positioned side by side in the radial direction, reducing headset unit thickness and avoiding a bulky appearance
3Ease of manufacture
If components are stacked in the thickness direction of the headset unit, then assembly is simplified, but the headset unit thickness increases and space utilization is inefficient
Solution Approach 1:
The component arrangement transitions from a thickness-direction stacked layout to a radial layout. The speaker shell is designed with a mounting chamber that accommodates the battery and circuit board in a radial arrangement, improving space utilization and reducing headset unit volume while maintaining assembly simplicity through integrated mounting structures
Data Source
Figure 1
Figure 2
Figure 3
AI summary
A headset (1) is disclosed. The headset (1) comprises a head band and two headset units (10) connected to two ends of the head band respectively, each headset unit (10) comprising a headset housing (20), a speaker assembly (30), an ear cap assembly (40), and a battery (50); at least one headset unit (10) further comprises a circuit board (60); the speaker assembly (30) is arranged in the headset housing (20) and comprises a speaker body (31) and a speaker shell (32), the speaker body (31) being connected to the speaker shell (32); the surface of the speaker shell (32) away from the ear cap assembly (40) fits with an inner wall surface of the headset housing (20) to enclose a mounting chamber (20a), the surface of the speaker shell (32) is formed with a first mounting surface (3211) and a second mounting surface (3212), the first mounting surface (3211) is connected to the battery (50), and the second mounting surface (3212) is connected to the circuit board (60); the first mounting surface (3211) and the second mounting surface (3212) are arranged in a direction perpendicular to a thickness direction of the headset unit (10), and at least one of the first mounting surface (3211) and the second mounting surface (3212) is arranged at a decreasing distance from the ear cap assembly (40) in a direction away from the other. The headset (1) can be thinner and lighter.