Multi-Wafer Optical Inspection Using Split-Beam Scanning
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Solution Overview
Problem
Current semiconductor fabrication processes face inefficiencies in wafer inspection, particularly in detecting defects across multiple wafers simultaneously, which hampers productivity and yield.
Innovation Solution
The development of a multi-wafer inspection apparatus that utilizes an optical module with an amplifier and splitting element to emit and split light beams for simultaneous inspection of multiple wafers, combined with rotatable and movable wafer holders and optical sensors to capture defect images.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple wafers are inspected sequentially using a single inspection apparatus, then the inspection can be performed with simple equipment, but the inspection efficiency and productivity are reduced
Solution Approach 1:
The patent divides the inspection system into multiple independent inspection channels, each capable of inspecting one wafer simultaneously. The apparatus includes multiple wafer holders, multiple light sources, multiple optical systems, and multiple detectors, allowing parallel inspection of multiple wafers to dramatically improve productivity while keeping each channel relatively simple
Solution Approach 2:
The patent combines multiple inspection systems into a single integrated apparatus that can inspect multiple wafers simultaneously. By merging multiple light sources, optical systems, detectors, and control units into one coordinated system, the patent achieves high-throughput inspection without requiring separate standalone inspection equipment for each wafer
2Productivity
If a single light beam is used for inspection, then the optical system is simple, but the ability to inspect multiple wafers simultaneously is limited
Solution Approach 1:
The optical system is segmented into multiple independent light beams, each directed at a different wafer. The patent uses multiple light sources or beam splitting mechanisms to create separate inspection paths, allowing each beam to independently inspect one wafer while maintaining relatively simple individual beam paths
Solution Approach 2:
The patent extends the inspection system from a single-dimensional (one beam, one wafer) to multi-dimensional configuration by arranging multiple light beams and wafer holders in spatial distribution. This allows simultaneous inspection across multiple dimensions of space, improving productivity while managing optical complexity through spatial organization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances inspection efficiency, allowing for simultaneous defect detection across multiple wafers, thereby improving productivity and yield in semiconductor fabrication.
Implementation Method 1
an optical module with an amplifier and splitting element to emit and split light beams
Implementation Method 2
The first wafer is configured to reflect the first light beam, and the second wafer is configured to reflect the second light beam
Data Source
AI summary
Wafer inspection apparatuses and methods are described. The wafer inspection apparatus includes an optical module, at least one wafer holder for carrying a plurality of wafers, and a plurality of optical sensors. The optical module is configured to emit a plurality of light beams for simultaneously scanning the plurality of wafers carried by the at least one wafer holder. The plurality of optical sensors is configured to receive the light beams reflected by the plurality of wafers.