Semiconductor Substrate Inspection With Parallel Split-Beam Imaging
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Solution Overview
Problem
The reduction in component sizes of semiconductor devices on substrates necessitates higher resolution inspections, leading to increased inspection time, which delays semiconductor processing.
Innovation Solution
A high-resolution inspection system that simultaneously illuminates and acquires images of multiple positions on semiconductor substrates using a beam splitter system to divide light beams into two, four, or eight, allowing for faster defect detection by examining reflected beams and comparing thicknesses against thresholds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If higher resolution inspection is used to inspect reduced-size semiconductor devices, then measurement precision is improved, but inspection time increases
Solution Approach 1:
The patent divides the inspection field into multiple regions and uses multiple illumination beams to simultaneously inspect different areas of the semiconductor substrate. By segmenting the inspection task across multiple parallel beams, the system achieves high-resolution inspection of multiple regions concurrently, thereby improving overall inspection throughput without sacrificing measurement precision
Solution Approach 2:
The patent transitions from sequential single-point inspection to parallel multi-point inspection by adding the dimension of spatial multiplicity. Multiple illumination beams are directed at different positions on the substrate simultaneously, converting a one-dimensional sequential scanning process into a multi-dimensional parallel inspection process, which dramatically reduces inspection time while maintaining high resolution
2Productivity
If traditional position-by-position inspection method is used, then device complexity is low, but productivity is reduced
Solution Approach 1:
The inspection system is segmented into multiple independent illumination channels, each capable of inspecting a specific region. This modular segmentation allows the system to process multiple regions in parallel, significantly improving productivity. The segmented approach maintains manageable complexity by using standardized beam delivery components for each channel
Solution Approach 2:
The patent employs a universal illumination system where a single light source is divided into multiple beams that can be independently directed to different positions on the substrate. This multi-functional illumination apparatus can inspect multiple regions with the same hardware platform, improving productivity without proportionally increasing overall system complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces inspection time by inspecting multiple positions simultaneously, potentially cutting the time in half, a fourth, or an eighth compared to traditional position-by-position methods, thereby enhancing processing efficiency.
Implementation Method 1
a beam splitter system that receives a first beam of light and splits the first beam of light into two, four, or eight beams of light
Implementation Method 2
in response to the transmitted two or more second beams of light, receiving two or more reflected beams of light from the two or more first locations
Data Source
AI summary
In a method of inspection of a semiconductor substrate a first beam of light is split into two or more second beams of light. The two or more second beams of light are respectively transmitted onto a first set of two or more first locations on top of the semiconductor substrate. In response to the transmitted two or more second beams of light, two or more reflected beams of light from the first set of two or more first locations are received. The received two or more reflected beams of light are detected to generate two or more detected signals. The two or more detected signals are analyzed to determine whether a defect exists at the set of the two or more first locations.