Split-Type Computer Case Structure for Motherboard Heat Dissipation
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Solution Overview
Problem
Traditional integrated computer cases face challenges in heat dissipation, particularly with the motherboard being obstructed by the power supply, and suffer from aesthetic fatigue leading to market saturation.
Innovation Solution
A split-type case structure separates the power supply and motherboard into distinct cases with an air intake slot in between, featuring air intake plates and baffles, along with air-cooled or water-cooled heat dissipation structures to enhance cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the power supply is installed near the motherboard in an integrated case, then the case structure is simple and cost is low, but the power supply blocks heat exchange between the motherboard and air, causing poor heat dissipation
Solution Approach 1:
The case is divided into two separate cases: a power supply case for the power supply and a motherboard case for the motherboard. This segmentation allows each component to have its own dedicated space, preventing the power supply from blocking the motherboard's heat dissipation while maintaining structural simplicity through modular design.
Solution Approach 2:
The power supply is extracted from the integrated case structure and placed in a separate power supply case. This extraction removes the blocking effect of the power supply on the motherboard's heat exchange with air, while the two cases remain connected through a wiring slot for electrical connections.
2Ease of operation
If the traditional all-in-one case structure is used, then installation is convenient and cost is low, but the market is saturated and consumers experience aesthetic fatigue
Solution Approach 1:
The case is segmented into separate power supply and motherboard cases, creating a unique visual appearance that distinguishes it from traditional all-in-one cases. This segmentation maintains installation convenience through modular assembly while providing aesthetic variety that appeals to consumers and enhances market competitiveness.
Solution Approach 2:
The design transitions from a single integrated case to a multi-case configuration connected through a wiring slot. This dimensional change in the case structure provides both functional benefits for heat dissipation and aesthetic benefits that differentiate the product in the market.
3Temperature
If the power supply case and motherboard case are separated, then heat dissipation is improved, but the case structure becomes more complex
Solution Approach 1:
The case is divided into two functional segments (power supply case and motherboard case) that are connected through a wiring slot. This segmentation improves heat dissipation by allowing independent airflow management for each component while maintaining relatively simple individual case structures.
Solution Approach 2:
The wiring slot serves as an intermediary connection between the power supply case and motherboard case. This intermediary structure enables both electrical connections and airflow passage, simplifying the overall design by combining multiple functions in a single structural element.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The split design improves heat dissipation for both the power supply and motherboard, enhancing operational performance and market competitiveness through effective airflow management and unique aesthetics.
Implementation Method 1
an air intake slot is provided between the power supply case and the motherboard case, and the power supply case and the motherboard case are respectively provided with an air intake plate on a side close to the air intake slot
Implementation Method 2
the motherboard is the part that generates the most heat among all the parts in the case, and has extremely high requirements for heat dissipation
Implementation Method 3
the power supply will greatly block the heat exchange between the motherboard and the air, especially in the case of an air-cooled heat dissipation structure
Data Source
AI summary
A split-type case structure that facilitates heat dissipation, comprising a case body, wherein the case body is composed of a power supply case and a motherboard case, wherein the power supply case and the motherboard case are configured to be split, wherein an air intake slot is provided between the power supply case and the motherboard case, and the power supply case and the motherboard case are respectively provided with an air intake plate on a side close to the air intake slot, and the power supply case and the motherboard case are connected through a wiring slot. The present application adopts a split-type case to replace the traditional one-piece case. The power supply and the motherboard are separated through the power supply case and the motherboard case, and are connected through the wiring slot.