Split-Cooling Inverter Layout for Compact EV Power Modules
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Solution Overview
Problem
Existing inverter designs for electric vehicles face challenges with increased dimensions and complex mounting due to parallel connections of power electronics modules, limiting flexibility and efficiency.
Innovation Solution
The inverter structure features split cooling branches for high-side and low-side switches, arranged opposite each other, with coolant flow in parallel or series, allowing for compact design and efficient heat dissipation without additional structural space, and enabling higher power density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a plurality of power electronics modules are connected in parallel to achieve higher performance class, then the required current capacity is improved, but the dimensions of the inverter increase significantly
Solution Approach 1:
The patent transitions from a linear arrangement of power modules along one dimension to a three-dimensional configuration where high-side and low-side modules are stacked vertically on opposite sides of a central cooling channel. This spatial reorganization allows multiple modules to occupy the same footprint area by utilizing the vertical dimension and central space, thereby increasing current capacity without proportionally increasing overall inverter dimensions.
Solution Approach 2:
The cooling channel is positioned centrally within the inverter structure, with high-side power modules arranged on one side and low-side modules on the other side, effectively nesting the cooling system within the power module arrangement. This nested configuration allows the cooling infrastructure to serve multiple modules simultaneously while occupying minimal additional space, enabling higher power density.
2Power
If two power electronics modules are connected in parallel arranged opposite each other on the heat sink, then the power capacity is improved, but only a maximum of two modules are possible without the inverter becoming significantly longer
Solution Approach 1:
Instead of extending the inverter length to accommodate additional modules in parallel, the patent utilizes the vertical dimension and width by arranging modules on opposite sides of a central cooling channel. This allows more than two modules to be connected in parallel while maintaining a compact overall length, as modules are distributed in three-dimensional space rather than linearly.
3Power
If a plurality of parallel modules are used to achieve required performance class, then the current capacity is improved, but the inverter structure becomes more complex with multiple DC and AC connection positions
Solution Approach 1:
The patent merges multiple DC connection points into a single common DC connection point where all high-side modules connect to the DC link. Similarly, AC connections are consolidated through a standardized interface. This merging approach maintains the parallel module configuration for high current capacity while significantly reducing the number of separate connection positions, thereby simplifying the mounting process and reducing structural complexity.
4Device complexity
If power semiconductors are arranged one behind the other from the intermediate circuit capacitor, then the electrical connection is simplified, but the clearance and creepage distance issues arise
Solution Approach 1:
The patent introduces a common DC connection point as an intermediary element that electrically connects all high-side power modules to the DC link. This intermediary approach allows modules to be arranged in a compact three-dimensional configuration on opposite sides of the cooling channel while maintaining simple electrical connections through the common connection point, thereby resolving both the connection simplicity and clearance distance requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design minimizes clearance and creepage distance issues, allows for more parallel connections without increasing length, and maintains efficient attachment to the intermediate circuit, achieving approximately 30% higher power density.
Implementation Method 1
at least one heat sink in the region of the half-bridges and connected thermally conductively to a cooling attachment situated on an underside of each semiconductor package
Data Source
AI summary
An inverter includes at least one phase and two driver boards situated opposite each other, and at least one half-bridge, arranged between the driver boards and contacted electrically and/or by signals, with, in each case, a semiconductor package formed as a high-side switch and a semiconductor package arranged parallel thereto and formed as a low-side switch. A heat sink in the region of the half-bridges and connected to a cooling attachment under each semiconductor package, wherein the heat sink has a split design so that a first cooling branch is arranged in the high-side branch and a second cooling branch is arranged in the low-side branch, wherein the cooling branches are arranged at a distance from each other, and the cooling branches are fluidically interconnected in parallel or in series in a region outside the arrangement of the semiconductor packages.