Split Detection Device Isolating Sensor From Processor Thermal Interference
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Solution Overview
Problem
Existing detection devices mounted on linear transmission devices suffer from detection errors due to thermal energy and minute vibrations generated by the processing chip, leading to reduced accuracy.
Innovation Solution
A split detection device design where the sensor and processor are housed in separate casings, with a connection unit for signal and power transmission between them, isolating thermal energy and vibrations to improve detection accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the sensor and processor are mounted on the same circuit board inside the same casing, then the device complexity is reduced, but the detection precision deteriorates due to thermal energy and vibrations from the processor affecting the sensor
Solution Approach 1:
The detection device is divided into separate functional modules: the sensor is mounted on a circuit board inside a first casing, while the processor is mounted on a different circuit board inside a second casing. This segmentation isolates the sensor from thermal energy and vibrations generated by the processor, thereby maintaining detection precision while managing device complexity through modular design.
Solution Approach 2:
The processor is extracted from the same casing as the sensor and placed in a separate second casing. This extraction removes the source of thermal energy and vibrations from proximity to the sensor, eliminating the harmful interference while preserving the integrated functionality of the detection device.
2Measurement precision
If the sensor and processor are separated into different casings, then the detection precision is improved, but the device complexity increases due to additional casings and connection units
Solution Approach 1:
The device is segmented into two casings with the sensor in the first casing and the processor in the second casing, connected via a connection unit. This segmentation achieves detection precision by isolating the sensor from harmful thermal and vibrational effects, while the connection unit provides a structured interface that manages the increased complexity through organized signal and power transmission paths.
3Volume of moving object
If the processor is placed close to the sensor for compact design, then the volume is reduced, but harmful thermal energy and vibrations from the processor interfere with the sensor
Solution Approach 1:
The processor is extracted from proximity to the sensor by placing it in a separate second casing. This extraction eliminates the harmful thermal energy and vibrations from affecting the sensor, while the casings are designed to be compact and the connection unit is optimized to minimize the distance between components, thereby balancing volume reduction with harmful factor isolation.
Solution Approach 2:
The casings are designed as protective enclosures that physically separate the sensor and processor while maintaining a compact overall form factor. The connection unit provides a flexible connection path that allows the components to be positioned optimally for both compactness and isolation from harmful effects.
Data Source
AI summary
A split detection device includes: a detection unit, which includes a detection casing and a sensor that is mounted inside the detection casing; a processing unit, which includes a processing casing and a processor that is mounted inside the processing casing; a connection unit, which is electrically connected between the sensor of the detection unit and the processor of the processing unit; and a transmission unit, which is electrically connected between the processor of the processing unit and an external device. By setting up the sensor and the processor inside different casings to be separate from each other, influence of the processor on the sensor can be reduced to thereby improve accuracy of detection.