Split Die Pad Semiconductor Package for Higher Passive Component Density
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Solution Overview
Problem
Existing semiconductor packages face limitations in component density, material costs, and flexibility in circuit design due to direct mounting of passive components on a single surface of the lead frame, which restricts the maximum density and requires expensive materials like silver palladium alloy.
Innovation Solution
A semiconductor package design where the semiconductor die is mounted on one surface of a split die pad, and a component module with passive components on the opposite surface of the lead frame, connected via a substrate, allowing for increased component density and reduced material costs, with the option to change circuits without altering the lead frame's conductive pattern.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If passive components are directly mounted on the lead frame using expensive materials like silver palladium alloy, then electrical connection reliability is improved, but material cost increases
Solution Approach 1:
The patent divides the package into two separate surfaces: the first surface for mounting the semiconductor die and the second surface for mounting passive components. This segmentation allows each surface to be optimized independently, enabling the use of cost-effective materials on the passive component surface while maintaining reliable electrical connections through the lead frame structure.
Solution Approach 2:
The patent transitions from a single-surface mounting approach to a dual-surface three-dimensional arrangement. By utilizing the opposite surface of the lead frame for passive components, the design increases spatial efficiency and reduces material costs without compromising electrical connection reliability, as connections are established through the conductive lead frame structure.
2Ease of manufacture
If passive components are mounted on the same surface as the semiconductor die, then assembly process is simplified, but component density is limited
Solution Approach 1:
The patent employs three-dimensional packaging by mounting passive components on the opposite surface of the lead frame from the semiconductor die. This dual-surface approach effectively doubles the available mounting area, significantly increasing component density while maintaining straightforward assembly processes through standardized mounting techniques.
3Device complexity
If a single surface is used for mounting both semiconductor die and passive components, then manufacturing complexity is reduced, but circuit design flexibility is limited
Solution Approach 1:
The patent segments the mounting surface into two distinct surfaces: the first surface for the semiconductor die and the second surface for passive components. This segmentation provides circuit design flexibility by allowing independent optimization of each surface's layout and circuit configuration, while manufacturing complexity remains manageable through standardized assembly processes for each surface.
Data Source
Figure 1A
Figure 1B
Figure 2~3A
AI summary
A semiconductor package comprises a leadframe, a component module, and a semiconductor die. The leadframe has a plurality of insertion terminals, a split die pad, and one or more leads. The component module has one or more passive components mounted on a substrate. The semiconductor die has an integrated circuit. The component module is mounted on a split die pad at a first surface of the leadframe and forms an electrical connection with the insertion terminals. Further, the semiconductor die is mounted on the split die pad at a second surface of the leadframe which is opposite to the first surface.