Split Upper Electrode Positioning for Multi-Region Plasma Treatment
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Solution Overview
Problem
Existing plasma processing apparatuses struggle to perform simultaneous treatment on the central and outer edge portions of a substrate due to structural limitations.
Innovation Solution
A plasma processing apparatus with a central top plate and an outer peripheral top plate, both electrically connected to an upper electrode, allows for relative displacement via a drive mechanism, enabling independent treatment of the central and outer edge portions by adjusting the distance between the substrate and these plates to control plasma formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a single electrode structure is used, then the device complexity is reduced, but the adaptability to treat different substrate regions is insufficient
Solution Approach 1:
The upper electrode is divided into two independent top plates: a central top plate and an outer peripheral top plate. Each plate can be independently positioned relative to the substrate, allowing separate treatment of the central portion and outer edge portion. This segmentation enables the single electrode structure to achieve multi-region treatment capability without requiring multiple separate electrodes.
Solution Approach 2:
The drive mechanism enables dynamic positioning of the central top plate and outer peripheral top plate relative to each other and to the substrate. By adjusting the distances between the substrate surface and each top plate independently, the system can adaptively configure the plasma generation regions to match different treatment requirements, transforming a static electrode structure into a dynamically adjustable one.
2Adaptability or versatility
If the distance between electrode and substrate is fixed, then the device complexity is reduced, but the ability to control plasma formation in different regions is insufficient
Solution Approach 1:
The drive mechanism provides dynamic control over the distances between the substrate surface and each top plate. By independently adjusting these distances, the system can control where plasma is generated - closer plates generate plasma in their respective regions. This dynamic distance control enables flexible plasma formation in different substrate regions without requiring complex additional control systems.
Solution Approach 2:
The system controls plasma formation by changing the physical parameter of distance between the electrode plates and substrate. By varying this distance parameter independently for each top plate, the system achieves different plasma generation conditions in different regions, enabling selective treatment of central and outer portions without altering other system parameters.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables simultaneous treatment of the central and outer edge portions of a substrate using the same apparatus, enhancing treatment flexibility and efficiency.
Implementation Method 1
plasma processing apparatuses that perform surface treatment of substrates using plasma generated between a pair of electrodes
Implementation Method 2
generates plasma between a lower electrode and an upper electrode
Data Source
AI summary
According to one embodiment, a plasma processing apparatus generates plasma between a lower electrode and an upper electrode. The plasma processing apparatus includes a processing table, a central top plate, an outer peripheral top plate, and a driver. The processing table is electrically connected to the lower electrode and includes a mounting surface on which a substrate to be treated is mounted. The central top plate is electrically connected to the upper electrode and includes a central surface facing the mounting surface. The outer peripheral top plate is electrically connected to the upper electrode and includes an outer peripheral surface facing the mounting surface and surrounds the outer periphery of the central surface. The driver relatively displaces the central top plate and the outer peripheral top plate.