Split Electronic Module Case for Sensor Substrate Assembly

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing electronic modules with boat-shaped cases face limitations in manufacturing due to restricted substrate positioning and directional constraints, leading to increased costs and reduced efficiency in electrical connections and mounting flexibility.

Innovation Solution

An electronic module design featuring a body case with multiple interlocking members and dual openings allows for high positioning accuracy and flexibility in substrate orientation, using a resin body to integrate the case members and substrate, enabling easy electrical connections and varied mounting configurations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a boat-shaped case with a single opening is used to house the substrate, then the case can be manufactured by resin molding at low cost, but the substrate positioning and electrical connection become restricted and complex

Engineering Contradiction:
Improvecase manufacturing costVSAvoidsubstrate positioning and electrical connection complexity
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The case is divided into multiple members (first case member and second case member) that can be separated from each other. This segmentation allows the substrate to be inserted from the side through the gap between members, eliminating the need for complex internal positioning structures and simplifying electrical connections while maintaining low-cost resin molding manufacturing.

Inventive Principle:
Principle #1Segmentation

2Ease of manufacture

If the metal pin is arranged standing from the bottom wall to reduce cost, then the electrical connection is simplified, but the substrate housing shape becomes limited and soldering operation efficiency decreases

Engineering Contradiction:
Improveelectrical connection simplificationVSAvoidsoldering operation efficiency
Core Design Contradiction:
Ease of manufactureVSProductivity

Solution Approach 1:

Instead of arranging the metal pin vertically from the bottom wall, the pin is positioned horizontally on the side surface of the case member. This dimensional change allows the substrate to be inserted from the side with the pin exposed, enabling soldering operations to be performed from the side rather than through the top opening, thereby improving operation efficiency while maintaining cost-effectiveness.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Manufacturing precision

If the case members are made separable to provide wide opening for substrate insertion, then positioning accuracy and mounting ease are improved, but the case structure becomes more complex

Engineering Contradiction:
Improvesubstrate positioning accuracyVSAvoidcase member structure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The first case member and second case member are designed to be separable, creating a wide opening for substrate insertion. The members are coupled together through simple coupling structures (such as protrusions and recesses) that provide precise positioning alignment. This merging of multiple members with simple coupling mechanisms achieves high positioning accuracy without significantly increasing overall structural complexity.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances waterproofing, strength, and manufacturing efficiency, allowing for cost-effective production of modules with diverse specifications and improved assembly processes.

Implementation Method 1

a resin body that covers the substrate by being filled into the internal space of the body case and solidified or hardened

Methodology Applied
Scientific EffectResin solidification: Phase Change

Data Source

PatentUS9474168B2Electronic module and method for manufacturing electronic module
Publication Date: 2016.10.18 SINFONIA TECHNOLOGY CO LTD
  • US9474168B2 patent drawing
  • US9474168B2 patent drawing
  • US9474168B2 patent drawing

AI summary

The Electronic Module includes body case 2 that comprises a plurality of case members 3, 4 by abutting each other and that has an internal space (S) where the first opening P1 is formed on one side surface of the internal space (S) and the second opening P2 that opens in a direction different from that of the first opening P1 is in an exposed state when a plurality of the case members 3, 4 are separated each other, a substrate 5 on which a sensor IC 51 is mounted and that is housed in the internal space (S) of the body case 2, and a resin body 6 that covers the substrate 5 by being filled in the internal space (S) of the body case 2 and solidified or hardened, and is characterized by that a plurality of the case members 3, 4.