Split-Fin Liquid Cooling Assembly to Prevent Fin Deformation

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Solution Overview

Problem

Conventional liquid cooling systems with large-sized heat dissipation fins are prone to deformation during manufacturing, leading to weaker product structure and reduced performance.

Innovation Solution

A liquid cooling assembly featuring a first and second heat dissipation assembly with fins connected by a splitter, forming separate cooling channels, which enhances thermal coupling and reduces fin deformation by using shorter fins.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If large-sized heat dissipation fins are used to increase heat exchange area, then heat dissipation efficiency is improved, but manufacturing deformation increases and product structure becomes weaker

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidfin deformation
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The heat dissipation assembly is divided into multiple smaller fin modules (first heat dissipation assembly and second heat dissipation assembly) connected by a splitter. Each module contains smaller fins that are less prone to deformation during manufacturing, while the combined structure provides sufficient total heat exchange area for effective heat dissipation.

Inventive Principle:
Principle #1Segmentation

2Reliability

If large-sized heat dissipation fins are used to increase heat exchange area, then heat dissipation efficiency is improved, but product structure strength decreases

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidproduct structure
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The structure is segmented into multiple smaller fin modules connected by a splitter, creating a distributed structure that maintains overall strength while providing sufficient heat exchange area. The modular design allows for better structural support of each individual fin section.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Multiple smaller heat dissipation assemblies are merged together through the splitter to form a complete heat dissipation system. This combining approach maintains structural integrity through the splitter connection while avoiding the weakness associated with large single-piece fins.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If large-sized heat dissipation fins are used to increase heat exchange area, then heat dissipation efficiency is improved, but manufacturing yield decreases

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidmanufacturing yield
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The heat dissipation assembly is segmented into smaller modular units with smaller fins that are easier to manufacture with consistent quality. This segmentation reduces manufacturing complexity and improves yield while maintaining adequate heat exchange area through the combined structure.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The assembly improves manufacturing yield and heat dissipation efficiency by preventing fin deformation and optimizing thermal contact areas.

Implementation Method 1

a first thermal contact surface configured to thermally couple to one of the plurality of heat sources, and a second thermal contact surface configured to thermally couple to one of the plurality of heat sources

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The first cooling channel and the second cooling channel are configured to accompany a cooling fluid

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS20250301600A1Liquid cooling assembly
Publication Date: 2025.09.25 COOLER MASTER CO LTD
  • US20250301600A1 patent drawing
  • US20250301600A1 patent drawing
  • US20250301600A1 patent drawing

AI summary

A liquid cooling assembly thermally coupled to multiple heat sources, includes a first heat dissipation assembly including a first base having a first thermal contact surface and a first inner surface positioned opposite to one another, the first thermal contact surface is thermally coupled to one of the heat sources, and a plurality of first fins protrude from the first inner surface, a second heat dissipation assembly including a second base have a second thermal contact surface and a second inner surface positioned opposite to one another, the first thermal contact surface is thermally coupled to one of the heat sources, the first inner surface and the second inner surface are facing toward to each other, and a plurality of second fins protrude from the second inner surface, and a splitter disposed between the first and the second heat dissipation assembly, ends of the first fins and the second fins are connected to the splitter.