Split Heat Sink Assembly for Lightweight Thermal Dissipation
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Solution Overview
Problem
Existing heat sinks are heavy, costly, and have limited thermal performance due to manufacturing constraints of extrusion, molding, and stamping processes.
Innovation Solution
A two-part heat dissipation assembly comprising a base plate and a heat sink, where the heat sink is independent of the base plate, allowing for separate manufacturing processes to optimize thermal performance and reduce weight, with features like protruding thermal contacts and optimized air channels for enhanced heat exchange.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a traditional integrated heat sink is manufactured using extrusion, molding, or stamping processes, then the structural integrity is maintained, but the weight is high, the cost is high, and the thermal performance is limited
Solution Approach 1:
The heat dissipation assembly is divided into two independent parts: a base plate and a heat sink. The heat sink is detached from the base plate and introduced through an opening in the base plate to contact the electronic component. This segmentation allows each part to be optimized separately - the base plate for structural support and the heat sink for thermal performance - while reducing overall weight compared to a traditional integrated design.
2Reliability
If a traditional integrated heat sink is manufactured using extrusion, molding, or stamping processes, then the structural integrity is maintained, but the manufacturing cost is high
Solution Approach 1:
The heat dissipation assembly is divided into two independent parts: a base plate and a heat sink. The heat sink is detached from the base plate and introduced through an opening in the base plate to contact the electronic component. This segmentation allows each part to be optimized separately - the base plate for structural support and the heat sink for thermal performance - while reducing overall weight compared to a traditional integrated design.
Solution Approach 2:
The heat sink function is extracted from the base plate structure. The heat sink is introduced through an opening in the base plate, separating the thermal management function from the structural support function. This allows the heat sink to be optimized purely for thermal performance using specialized manufacturing processes, while the base plate can be manufactured using cost-effective stamping or molding processes.
3Ease of manufacture
If the heat sink is integrated with the base plate, then the structural support function is combined, but the thermal performance is limited and weight is high
Solution Approach 1:
The heat dissipation assembly is divided into two independent parts: a base plate and a heat sink. The heat sink is detached from the base plate and introduced through an opening in the base plate to contact the electronic component. This segmentation allows each part to be optimized separately - the base plate for structural support and the heat sink for thermal performance - while reducing overall weight compared to a traditional integrated design.
Solution Approach 2:
The base plate serves multiple functions: it provides structural support for the electronic component and serves as a mounting platform for the heat sink. The heat sink is introduced through an opening in the base plate, allowing the base plate to fulfill both structural and thermal management support roles without being thermally optimized itself.
4Reliability
If separate manufacturing processes are used for the base plate and heat sink, then the thermal performance is optimized and weight is reduced, but the assembly complexity increases
Solution Approach 1:
The heat sink is inserted through an opening in the base plate and positioned to contact the electronic component from the opposite side. This nesting approach allows the heat sink to be integrated into the base plate structure during assembly, creating a compact unified assembly from two separately manufactured parts. The opening in the base plate serves as the pathway for introducing and positioning the heat sink.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The assembly achieves lightweight, cost-effective, and efficient heat dissipation by leveraging different manufacturing methods for the base plate and heat sink, ensuring optimal thermal performance and reduced component count.
Implementation Method 1
a heat sink independent of the base plate and comprising at least one thermal contactor (21) introduced through the at least one opening (11) and arranged to be in thermal contact with the electronic component (41)
Implementation Method 2
the heat sink (20) may include a raised surface (28) opposite the thermal contactor (21), the raised surface maximizing heat exchange with the surrounding atmosphere
Implementation Method 3
the heat sink (20) may include a raised surface (28) opposite the thermal contactor (21), the raised surface maximizing heat exchange with the surrounding atmosphere
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
Thermal dissipation assembly comprising: a. a base plate (10) including at least one opening (11) and fixing elements for holding an electronic component opposite the at least one opening (11), and b. a heat sink (20) independent of the base plate (10) and including at least one thermal contactor introduced through the at least one opening (11) and arranged to be in thermal contact with the electronic component.