Split Heat-Sink Structure for HAMR Media
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Heat-assisted magnetic recording (HAMR) media face challenges in achieving high areal density and efficient thermal management due to the limitations of conventional thermal designs, including the use of thick heat-sink layers that increase laser power consumption and degrade recording performance.
Innovation Solution
A split heat-sink structure (SHSS) with a heat-sink break layer (HSBL) is introduced, reducing the total thickness of the heat-sink layer by 20% while maintaining similar signal-to-noise ratio, and eliminating the need for a thermal barrier layer, thereby reducing laser power consumption and improving manufacturability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thick heat-sink layer is used to dissipate thermal energy, then thermal management is improved, but laser power consumption increases and recording performance degrades
Solution Approach 1:
The heat-sink layer is divided into two separate heat-sink layers (first heat-sink layer and second heat-sink layer) with a heat-sink break layer positioned between them. This segmentation allows each heat-sink layer to be optimized independently for thermal dissipation efficiency, reducing the total thickness required and thereby lowering laser power consumption while maintaining effective heat management.
Solution Approach 2:
The heat-sink break layer acts as an intermediary between the first and second heat-sink layers. It provides thermal isolation that prevents excessive heat accumulation, allowing the heat-sink structure to be thinner while still achieving effective thermal management, thus reducing the laser power required for heating during recording operations.
2Temperature
If a thick heat-sink layer is used to dissipate thermal energy, then thermal management is improved, but recording performance degrades
Solution Approach 1:
By segmenting the heat-sink layer into two distinct layers separated by a heat-sink break layer, the patent achieves superior thermal management that prevents overheating and maintains optimal recording conditions. This segmentation allows for better control of thermal gradients across the medium, improving recording performance and reliability while using less material.
3Temperature
If a thermal barrier layer is used to manage heat, then thermal control is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The heat-sink break layer serves multiple functions simultaneously: it provides thermal isolation between heat-sink layers, maintains structural integrity of the stacked configuration, and contributes to overall heat dissipation. This multi-functionality eliminates the need for a separate thermal barrier layer, reducing device complexity while maintaining effective thermal control.
Solution Approach 2:
The patent merges the thermal management functions into the heat-sink layer structure itself by incorporating the heat-sink break layer within the stacked configuration. This integration eliminates the need for additional thermal barrier layers, simplifying the overall device structure while achieving effective thermal control.
4Temperature
If a thermal barrier layer is used to manage heat, then thermal control is improved, but manufacturing complexity and maintenance increase
Solution Approach 1:
The heat-sink break layer performs multiple functions including thermal isolation and structural support, eliminating the need for separate thermal barrier layer deposition processes such as RF sputtering. This reduces manufacturing complexity and removes the need for specialized equipment and maintenance while maintaining effective thermal control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The SHSS design enhances magnetic recording performance by efficiently dissipating heat, reducing surface roughness, and allowing for lower laser power usage, while also eliminating the need for costly and maintenance-intensive RF sputtering processes.
Implementation Method 1
a first heat-sink layer disposed on the substrate, a heat-sink break layer disposed on the first heat-sink layer, and a second heat-sink layer disposed on the heat-sink break layer
Implementation Method 2
By heating the surface of the magnetic recording medium with a laser spot during write operations, coercivity of the magnetic recording medium is reduced
Data Source
AI summary
A heat-assisted magnetic recording (HAMR) medium includes a substrate, a split heat-sink structure (SHSS) and a magnetic recording layer. The SHSS includes a first heat-sink layer disposed on the substrate, a heat-sink break layer (HSBL) disposed on the first heat-sink layer, and a second heat-sink layer disposed on the HSBL. The magnetic recording layer is disposed on the SHSS. The SHSS is configured to enable use of a reduced operating current of the laser while maintaining about the same write performance properties as a thermal barrier layer, heat-assisted magnetic recording (TBLHAMR) medium that includes a thermal barrier layer (TBL) and a heat-sink layer that is greater than about 20% thicker than the thickness of the SHSS. A HAMR data storage device that incorporates the HAMR medium within a HAMR disk, and a method for making the HAMR medium are also described.