Split Hinge Frame Design for Thin Computing Devices

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Solution Overview

Problem

Existing hinge assemblies in thin computing devices, such as laptops and tablets, face challenges in achieving a balance between thinness, ease of opening and closing, and structural strength, often compromising on material removal which weakens the hinge frame and increases thickness.

Innovation Solution

The implementation of a split hinge frame configuration with blind guide slots and an integrated guide pin, allowing for a stronger and thinner hinge assembly by eliminating the need for material removal and optimizing stress distribution, while maintaining ease of assembly and reducing friction and wobbling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of stationary object

If material is removed from the hinge frame to reduce thickness, then the z-height is reduced, but the structural strength is weakened

Engineering Contradiction:
Improvez-height of hinge assemblyVSAvoidstructural strength of hinge frame
Core Design Contradiction:
Length of stationary objectVSStrength

Solution Approach 1:

The hinge frame is divided into multiple segments including a stationary frame portion, a movable arm portion, and intermediate support structures. This segmentation allows each part to be optimized independently - the frame can be made thinner in non-critical areas while maintaining strength in load-bearing regions through strategic placement of pins, bushings, and support elements.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The hinge design transitions from a traditional single-plane structure to a multi-dimensional configuration with components arranged in x, y, and z dimensions. The blind guide slots provide guidance in one dimension while the friction pins and bushings handle forces in perpendicular dimensions, allowing the frame to be thinner without compromising structural integrity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Length of stationary object

If the hinge assembly is made thinner, then the device profile is reduced, but the ease of opening and closing deteriorates due to increased friction

Engineering Contradiction:
Improvethickness of hinge assemblyVSAvoidease of opening and closing
Core Design Contradiction:
Length of stationary objectVSEase of operation

Solution Approach 1:

Bushings are introduced as intermediary elements between the friction pins and the hinge frame components. These bushings act as mediators that reduce direct metal-to-metal contact, thereby reducing friction and wear while enabling smooth rotation in the thinner hinge assembly structure.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The design changes physical parameters including the introduction of low-friction materials for bushings, optimization of pin diameters and lengths, and precise control of clearance tolerances. These parameter changes reduce the coefficient of friction between moving parts, enabling easy operation despite the reduced overall thickness of the hinge assembly.

Inventive Principle:
Principle #35Parameter changes

3Ease of manufacture

If traditional hinge configurations are used, then ease of assembly is maintained, but the device thickness increases

Engineering Contradiction:
Improveease of assemblyVSAvoidz-height of hinge assembly
Core Design Contradiction:
Ease of manufactureVSLength of stationary object

Solution Approach 1:

Multiple functions are merged into single components to reduce the number of parts and overall thickness. For example, the hinge pin serves both as a rotational axis and a structural connector, while the blind guide slots provide both guidance and structural support. This merging eliminates the need for separate thick components while maintaining assembly simplicity through standardized fastening methods.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The blind guide slots are pre-formed in the hinge frame before final assembly, and the friction pins are pre-positioned with appropriate clearances. This preliminary preparation of critical features ensures that the thin hinge components can be assembled without requiring complex machining or adjustment operations during final assembly, thereby maintaining ease of manufacture despite the reduced thickness.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS10620672B2Low profile device hinge assembly
Publication Date: 2020.04.14 MICROSOFT TECHNOLOGY LICENSING LLC
  • US10620672B2 patent drawing
  • US10620672B2 patent drawing
  • US10620672B2 patent drawing

AI summary

The description relates to hinged devices, such as hinged computing devices. One example can include a first portion and a second portion that are rotatably coupled by a hinge assembly. The hinge assembly can include a hinge frame secured to the first portion and a hinge arm secured to the second portion. The hinge frame can be rotatably secured to the hinge arm by a band extending between a guide pin retained in the hinge frame and a friction pin secured to the hinge arm.