Split Semiconductor Laser Diode Energy Integrating Device
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Solution Overview
Problem
Conventional methods for integrating semiconductor laser diodes, such as wafer arrays and optical fiber coupling, are complex, costly, and unsuitable for mass production, particularly due to high precision requirements, heat emission, and inefficiencies in beam integration, making them impractical for the household physiotherapy industry.
Innovation Solution
A compact energy integrating device with a disc-shaped holder and module bases for symmetrically mounting semiconductor laser diodes, using a printed circuit board and aspheric lens to focus beams into a single spot, simplifying the integration process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If wafer array method is used for beam integration, then laser power is increased, but device complexity and manufacturing difficulty increase due to extreme-high precision lens array requirements
Solution Approach 1:
The invention divides the laser source into multiple independent semiconductor laser diodes (typically 3-5 diodes) arranged in a specific geometric pattern, with each diode contributing to the integrated beam. This segmentation approach allows independent mounting and adjustment of each diode, avoiding the need for complex lens arrays while achieving high power through combination of multiple sources
Solution Approach 2:
The invention merges multiple laser beams from separate semiconductor laser diodes into a single integrated beam through precise geometric arrangement and optical focusing. The beams are combined spatially and temporally to create one high-power output, eliminating the need for complex lens arrays required by wafer array methods
2Power
If wafer array method is used for beam integration, then laser power is increased, but heat dissipation requirements become extremely high
Solution Approach 1:
By using independent semiconductor laser diodes instead of a dense wafer array, the heat generation is distributed across separate components with individual mounting points. This allows for more effective thermal management through separate heat sinks and cooling paths for each diode, reducing the heat dissipation challenge compared to concentrated wafer arrays
Solution Approach 2:
The invention introduces individual heat sinks and mounting structures as intermediary elements between each laser diode and the final assembly. These intermediaries provide dedicated thermal pathways for each diode, facilitating efficient heat removal and preventing thermal accumulation that would occur in densely packed wafer arrays
3Power
If optical fiber coupling method is used for beam integration, then beam integration is achieved, but beam integrating efficiency is low and laser characteristics are destroyed
Solution Approach 1:
The invention replaces the optical fiber coupling system with a direct free-space optical path. By using precise geometric arrangement of laser diodes and simple focusing optics, the system eliminates the mechanical fiber coupling process entirely, achieving high integration efficiency while preserving laser beam characteristics through direct optical propagation
4Power
If conventional integration methods are used, then beam integration is achieved, but costs are high due to expensive lens array and optical fiber systems
Solution Approach 1:
The invention replaces expensive, precision-manufactured lens arrays and optical fiber systems with simpler, lower-cost components. The use of standard semiconductor laser diodes with basic mounting structures and simple focusing optics significantly reduces material costs and manufacturing expenses, making high-power laser integration economically viable
Solution Approach 2:
The invention changes the design parameters from high-precision optical components to geometrically arranged diode arrays with tolerance-friendly mounting. By shifting from lens-based focusing to direct geometric beam combination, the system achieves the same integration function at lower cost with relaxed manufacturing tolerances
5Power
If conventional integration methods are used, then beam integration is achieved, but processes are complex and mass production is impossible
Solution Approach 1:
The invention segments the laser system into independent, identical modules (individual laser diodes with their own mounts and heat sinks). This modular segmentation allows each unit to be manufactured, tested, and adjusted separately, then assembled in a standardized configuration, enabling mass production through repetitive assembly processes rather than complex custom fabrication
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a cost-effective, easy-to-manufacture device that integrates semiconductor laser diodes efficiently, with a compact design and precise beam alignment, suitable for household applications and reducing the complexity of conventional integration methods.
Implementation Method 1
the laser beams from the laser modules are focused onto one laser spot through a positive lens
Data Source
AI summary
An energy integrating device for split semiconductor laser diodes includes: an installing holder, wherein the installing holder has a disc structure with a positioning hole at a center thereof, four module bases for mounting laser modules are symmetrically provided at one side of the disc structure, and the laser modules are embedded inside the module bases; a printed circuit board, connected to the laser modules through sleeves, is mounted at one side of the module bases, and a wire and a plug are mounted on the printed circuit board for connecting a power source; the laser modules are adjusted and positioned through fastening screws, and laser beams thereof are emitted through surface holes of the installing holder with the disc structure; the laser beams from the laser modules are focused onto one laser spot through a positive lens.