Split Laser Beam Glass Cutting and Shaping Without Fracturing
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Solution Overview
Problem
Mechanical cutting and grinding of glass substrates for magnetic recording media like HAMR and PMR result in fracturing, dimensional errors, and high costs due to stringent surface roughness and tight dimensional precision requirements, impacting storage capacity and throughput.
Innovation Solution
An apparatus using a beam splitter and mirrors to split laser beams for non-mechanical cutting and shaping of glass substrates, potentially incorporating spatial diffractive optics arrays to modify laser beams for precise cutting and shaping without mechanical means.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If mechanical cutting and grinding is used on glass substrates, then dimensional precision and surface roughness can be achieved, but fracturing occurs and throughput is reduced
Solution Approach 1:
The patent replaces mechanical cutting and grinding systems with a laser-based system that uses optical energy to cut and shape glass substrates. The laser beam melts and vaporizes glass material through controlled heating, eliminating mechanical contact that causes fracturing and reducing processing time to improve throughput while maintaining precision.
Solution Approach 2:
The patent changes the physical state and properties of glass material through laser-induced heating, transitioning from solid-state mechanical processing to thermal processing. By controlling laser parameters such as power, pulse duration, and scanning speed, the system achieves precise dimensional control without mechanical forces that cause fracturing.
2Manufacturing precision
If mechanical cutting and grinding is used on glass substrates, then dimensional precision can be achieved, but fracturing occurs
Solution Approach 1:
The patent replaces mechanical cutting and grinding systems with a laser-based system that uses optical energy to cut and shape glass substrates. The laser beam melts and vaporizes glass material through controlled heating, eliminating mechanical contact that causes fracturing and reducing processing time to improve throughput while maintaining precision.
Solution Approach 2:
The patent utilizes phase transitions of glass material from solid to liquid to vapor through laser-induced heating. The laser energy causes localized melting and subsequent vaporization of glass, enabling clean separation without mechanical stresses that lead to fracturing, thereby improving reliability.
3Ease of manufacture
If mechanical cutting and grinding is used on glass substrates, then cutting can be performed, but costs increase due to stringent requirements
Solution Approach 1:
The patent replaces mechanical cutting and grinding systems with a laser-based system that uses optical energy to cut and shape glass substrates. The laser beam melts and vaporizes glass material through controlled heating, eliminating mechanical contact that causes fracturing and reducing processing time to improve throughput while maintaining precision.
Solution Approach 2:
The patent changes the physical state and properties of glass material through laser-induced heating, transitioning from solid-state mechanical processing to thermal processing. By controlling laser parameters such as power, pulse duration, and scanning speed, the system achieves precise dimensional control without mechanical forces that cause fracturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for precise cutting and shaping of glass substrates with reduced fracturing and dimensional errors, enhancing storage capacity and throughput by eliminating mechanical cutting and grinding processes.
Implementation Method 1
The beam splitter is positioned to receive a laser beam from a source and split the received laser beam to a first plurality of split laser beams and a second plurality of split laser beams
Implementation Method 2
The plurality of mirrors is configured to direct the first plurality of split laser beams and further configured to direct the second plurality of split laser beams
Implementation Method 3
The first plurality of split laser beams directed by the plurality of mirrors is configured to cut a glass substrate. The second plurality of split laser beams directed by the plurality of mirrors is configured to shape the glass substrate
Data Source
AI summary
An apparatus includes a beam splitter and a plurality of mirrors. The beam splitter is positioned to receive a laser beam from a source and split the received laser beam to a first plurality of split laser beams and a second plurality of split laser beams. The plurality of mirrors is configured to direct the first plurality of split laser beams and further configured to direct the second plurality of split laser beams. The first plurality of split laser beams is directed by the plurality of mirrors is configured to cut a glass substrate. The second plurality of split laser beams is directed by the plurality of mirrors is configured to shape the glass substrate.