Split Manufacturing Security via Placement Perturbation

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Solution Overview

Problem

The semiconductor industry faces significant security vulnerabilities due to the high cost of maintaining state-of-the-art manufacturing facilities, leading to outsourcing which introduces risks of reverse engineering, malicious circuit insertion, and intellectual property piracy, as current design tools do not prioritize security in the distributed supply chain.

Innovation Solution

Implementing split manufacturing of integrated circuits, where only the front-end-of-line layers are manufactured at an untrusted high-end foundry and the back-end-of-line layers at a trusted low-end foundry, using network-flow based attacks and placement perturbation techniques to enhance security while minimizing overhead.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the semiconductor industry outsources fabrication to high-end foundries to reduce manufacturing costs, then fabrication cost decreases, but security vulnerabilities increase due to lack of control over design in distributed supply chain

Engineering Contradiction:
Improvefabrication costVSAvoidsecurity vulnerabilities
Core Design Contradiction:
Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The fabrication process is segmented into two distinct parts: FEOL (front-end-of-line) manufacturing performed at an untrusted high-end foundry, and BEOL (back-end-of-line) manufacturing performed at a trusted low-end foundry. This segmentation allows the design to be split such that critical security-sensitive layers are manufactured in a trusted environment while still leveraging high-end fabrication capabilities for the non-critical FEOL layers, thereby reducing overall security vulnerabilities while maintaining cost efficiency

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A trusted foundry acts as an intermediary in the supply chain, receiving the FEOL-manufactured substrates and completing the BEOL fabrication process. This intermediary trusted entity ensures that the critical portions of the manufacturing process occur in a secure environment, mitigating the security risks associated with outsourcing to untrusted foundries while still allowing cost-effective outsourcing of the FEOL process

Inventive Principle:
Principle #24Intermediary (Mediator)

2Device complexity

If designers have no control over their design in distributed supply chain, then globalization of IC production flow reduces design complexity and fabrication cost, but attackers can perform reverse engineering, malicious circuit insertion, and IP piracy

Engineering Contradiction:
Improvedesign complexityVSAvoidattacks (reverse engineering, malicious insertion, IP piracy)
Core Design Contradiction:
Device complexityVSObject-affected harmful factors

Solution Approach 1:

The design is segmented into FEOL and BEOL portions, with the BEOL containing security-critical elements that remain under designer control through trusted foundry manufacturing. This segmentation maintains design integrity for critical functions while still allowing globalization benefits for non-critical portions

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The design incorporates preliminary security measures through the split manufacturing approach, where the BEOL layers are specifically designed to prevent reverse engineering and malicious insertion. The trusted foundry process and design techniques applied to BEOL create inherent security barriers before the product reaches the market, countering potential attacks in advance

Inventive Principle:
Principle #9Preliminary anti-action

3Object-affected harmful factors

If split manufacturing is implemented to enhance security, then security vulnerabilities are reduced, but manufacturing complexity increases due to coordination between multiple foundries

Engineering Contradiction:
Improvesecurity vulnerabilitiesVSAvoidmanufacturing complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The manufacturing process is segmented into two independent but coordinated stages: FEOL manufacturing at one foundry and BEOL manufacturing at another. This segmentation allows each foundry to operate independently with well-defined interfaces, reducing the overall manufacturing complexity compared to a fully integrated process while still achieving security benefits

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS10867937B2Defense techniques for split manufacturing
Publication Date: 2020.12.15 TEXAS A&M UNIVERSITY
  • US10867937B2 patent drawing
  • US10867937B2 patent drawing
  • US10867937B2 patent drawing

AI summary

Disclosed are various embodiments to enhance the security of a circuit design after a global routing of the circuit design and an assignment of wire layers for the circuit design. A tree can be extracted from the circuit design. The tree can include multiple gates and location information for the gates. The tree can be perturbed by moving one or more locations of one or more gates.