Split Medical Assembly With Isolator Sealing for CGM Sensor Reuse

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Solution Overview

Problem

The sealing ring in existing Continuous Glucose Monitoring (CGM) devices can loosen, leading to poor sealing and affecting the device's performance.

Innovation Solution

A split-type medical apparatus with a first housing, an electronic module, and an isolator that includes a groove-shaped portion and protrusions to enhance sealing, allowing the sensor to be electrically connected while maintaining a sealed environment, and an isolator made using injection molding to improve sealing performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a sealing ring is used at the junction of the upper housing and lower housing, then the electronic module can be sealed, but the sealing ring may loosen over time leading to poor sealing effect

Engineering Contradiction:
Improvesealing performanceVSAvoidsealing ring stability
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

The sealing structure is segmented into multiple functional regions: a first sealing region with the sealing ring at the housing junction, and a second sealing region with the protrusion extending into the electronic module. This segmentation allows each region to perform its sealing function independently, preventing the loosening problem from affecting the entire sealing system.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The protrusion is pre-configured to extend from the housing toward the electronic module before assembly, creating a preliminary sealing barrier. During assembly, the protrusion is compressed between the housing and the electronic module, establishing a reliable seal before any loosening can occur.

Inventive Principle:
Principle #10Preliminary action

2Reliability

If the electronic module is sealed to maintain working performance, then the sensor connection area must be accessed for electrical connection, but sealing the connection area compromises electrical connectivity

Engineering Contradiction:
Improveelectronic module sealingVSAvoidsensor electrical connection
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The isolator exhibits different properties in different regions: it is sealed and protective in most areas, but features an exposed connection area that is accessible for electrical connection. This local differentiation allows the isolator to simultaneously provide sealing protection and enable sensor connectivity without compromising either function.

Inventive Principle:
Principle #3Local quality

3Adaptability or versatility

If a split-type assembly method is used to enable reuse of the electronic module, then the device can be disassembled and reused, but the detachable connection may compromise sealing integrity

Engineering Contradiction:
Improveelectronic module reusabilityVSAvoidsealing integrity
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The sealing system is segmented into multiple independent sealing regions (sealing ring at the housing junction and protrusion at the electronic module interface). This segmentation ensures that even in a detachable assembly, each sealing region maintains its integrity independently, preserving overall sealing reliability while enabling module reuse.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus achieves improved sealing by using an isolator with deformable protrusions to create sealed spaces, preventing undesired substances from entering and enhancing the stability of electronic components.

Implementation Method 1

the protrusion deforms in the direction from the second housing toward the first housing

Methodology Applied
Scientific EffectDeformation: Deformation

Implementation Method 2

the isolator has a groove-shaped portion matching the mount and a functional surface facing away from the electronic module, with a protrusion surrounding the groove-shaped portion provided on the functional surface

Methodology Applied
Scientific EffectElasticity: Elasticity

Data Source

PatentEP4725413A1Split-type medical apparatus and preparation method for electronic assembly thereof
Publication Date: 2026.04.15 SHENZHEN SISENSING TECH CO LTD
  • EP4725413A1 patent drawingFigure 1~2
  • EP4725413A1 patent drawingFigure 3~4A
  • EP4725413A1 patent drawingFigure 4B~5A

AI summary

The present disclosure relates to a split-type medical apparatus(10) and a method for preparing its electronic assembly(100). The split-type medical apparatus(10) includes a first housing(110), an electronic module(120) and an isolator(130) disposed on the first housing(110), a second housing(200) detachably assembled with the first housing(110), and a sensor(12) disposed on the second housing(200). The second housing(200) includes a mount(210) for the sensor(12) which can be placed subcutaneously; the isolator(130) has a groove-shaped portion(131) matching the mount(210) and a functional surface(132) facing away from the electronic module(120), with a protrusion(133) surrounding the groove-shaped portion(131) provided on the functional surface(132). The electronic module(120) includes a connection area(121) for electrical connection with the sensor(12). The isolator(130) is attached to the first housing(110) and covers the electronic module(120) in such a way that the connection area(121) is exposed in the groove-shaped portion(131); when the first housing(110) is assembled to the second housing(200), the isolator(130) is located between the second housing(200) and the first housing(110), and the protrusion(133) deforms in the direction from the second housing(200) toward the first housing(110). According to the present disclosure, a split-type medical apparatus(10) with improved sealing effect and a method for preparing its electronic assembly(100) can be provided.