Split Power Supply for Memory Overclocking
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Solution Overview
Problem
Existing memory devices face limitations in overclocking performance due to variations in memory chip fabrication, where the weakest chip determines the overall overclocking capability, and there is a need for improved power supply management to ensure all chips operate effectively at higher frequencies.
Innovation Solution
A memory device with split power supply capability, featuring separate power modules for different sets of memory chips, each with a power management chip and adjustable power parameters, allowing for independent configuration of voltage and current to optimize performance based on individual chip requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single power supply is used for all memory chips, then the power supply structure is simple, but the overclocking performance is limited by the weakest chip
Solution Approach 1:
The patent divides the memory chips into multiple groups and provides separate power supply modules for each group. This segmentation allows each group to receive customized power supply parameters (voltage, current) tailored to their specific overclocking capabilities, thereby improving overall overclocking performance while maintaining manageable structural complexity through modular design
Solution Approach 2:
The patent implements local quality by providing differentiated power supply parameters to different groups of memory chips based on their individual overclocking performances. Each group receives customized voltage and current settings optimized for their specific characteristics, allowing the weakest and strongest chips to operate at their optimal performance points simultaneously
2Productivity
If power supply parameters are customized for each chip, then overclocking performance is improved, but the power supply management complexity increases
Solution Approach 1:
The patent segments the power supply management into separate modules, each responsible for a specific group of memory chips. This segmentation reduces the complexity of managing customized power parameters by distributing the management function across multiple independent units, each handling a subset of chips with similar characteristics
Solution Approach 2:
The patent employs universal power supply modules that can be configured to serve different groups of memory chips with varying overclocking requirements. Each module is designed with multi-functionality to accommodate different voltage and current settings, allowing a single module design to serve multiple purposes across different chip groups
Data Source
AI summary
A memory device includes a printed circuit board having a plurality of conductive layers; memory chips mounted over the printed circuit board, wherein the memory chips comprise at least a first number of memory chips and a second number of memory chips; a first power module mounted over the printed circuit board and for providing a first set of power supplies to the first number of memory chips through the plurality of conductive layers; and a second power module mounted over the printed circuit board and for providing a second set of power supplies to the second number of memory chips through the plurality of conductive layers.