Split Elastic Wave Resonator Layout for Heat Dissipation

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Solution Overview

Problem

Conventional elastic wave filters face challenges in achieving high power durability due to inefficient heat dissipation, leading to increased temperature and device size, as the placement of heat exhaust bumps is limited and separated from the heat-generating elements, which hampers effective heat dissipation.

Innovation Solution

The elastic wave device incorporates split resonators connected in parallel with a bump positioned between the reflectors, allowing for efficient heat dissipation without altering the capacitance, using Au bumps for enhanced conductivity and maintaining the same resonance frequency across split resonators to prevent signal attenuation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If heat exhaust bumps are placed away from heat-generating elements to simplify structure, then device complexity is reduced, but heat dissipation efficiency deteriorates leading to increased temperature

Engineering Contradiction:
Improvestructure complexityVSAvoiddevice temperature
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The resonator is divided into multiple split resonators (first split resonator and second split resonator) connected in parallel. This segmentation allows heat exhaust bumps to be positioned at multiple locations including between the split resonators, thereby improving heat dissipation efficiency without significantly increasing structural complexity

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent utilizes the spatial dimension between the split resonators to position heat exhaust bumps. By exploiting the space between adjacent split resonators connected in parallel, the design creates additional heat exhaust pathways without occupying excessive area or complicating the overall structure

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If the number of comb-shaped electrode pairs per resonator is increased to improve power durability, then power durability is improved, but device area increases

Engineering Contradiction:
Improvepower durabilityVSAvoiddevice area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

Instead of increasing the number of electrode pairs in a single resonator, the patent segments the resonator into multiple split resonators connected in parallel. This approach maintains power durability by distributing the electrical load across multiple parallel paths while avoiding the area increase that would result from expanding a single resonator's electrode pairs

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Multiple split resonators are merged in parallel connection to achieve the desired power durability. The parallel configuration combines the electrical pathways of individual split resonators, effectively increasing the total current handling capability and power durability without requiring each individual resonator to have excessive electrode pairs

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances power durability by improving heat dissipation efficiency and maintaining signal integrity, reducing the device's temperature and size while maintaining the same resonance characteristics as non-split resonators.

Implementation Method 1

an elastic wave resonator having comb-shaped electrodes that have been formed from an aluminum alloy, a Cu alloy, or the like on a piezoelectric substrate, a piezoelectric thin film, or the like

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Implementation Method 2

Heat is exhausted from the piezoelectric substrate by allowing the heat to escape to a connection substrate mainly via a package or the like

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUSRE48129E1Elastic wave device, duplexer using the same, and communication apparatus using the duplexer
Publication Date: 2020.07.28 TAIYO YUDEN KK
  • USRE48129E1 patent drawing
  • USRE48129E1 patent drawing
  • USRE48129E1 patent drawing

AI summary

An elastic wave device includes resonators having a piezoelectric substrate, a resonation unit formed on the piezoelectric substrate, and reflectors formed on respective sides of the resonation unit on the piezoelectric substrate, and bumps formed on the piezoelectric substrate. The resonators are configured such that two or more split resonators are connected in parallel, and a bump is formed in a region sandwiched between reflectors of the split resonators.