Split Resonator PCB for Electromagnetic Interference Absorption
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Solution Overview
Problem
Printed circuit boards (PCBs) generate high-frequency electromagnetic waves that cause electromagnetic interference (EMI), leading to malfunctions and adverse effects on both devices and human health, and existing shielding technologies have limitations in effectively absorbing these waves.
Innovation Solution
A split resonator design is integrated into the PCB, featuring a dielectric substrate with pairs of conductors spaced apart and connected in a cylindrical shape, functioning as capacitors and inductors to absorb electromagnetic waves through structural resonance, thereby enhancing electromagnetic shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional shielding materials (metal layers, conductive films) are used to block electromagnetic waves, then shielding effectiveness is improved, but the structure becomes more complex and manufacturing difficulty increases
Solution Approach 1:
The patent changes the fundamental parameter of shielding approach from blocking (metal layers) to absorbing (resonator structures). The split resonator is designed with specific geometric parameters (conductor width, spacing, substrate thickness) that can be tuned to resonate at target frequencies, transforming the shielding mechanism from passive blocking to active frequency-selective absorption, thereby reducing structural complexity while maintaining effectiveness
Solution Approach 2:
The patent employs a composite structure combining dielectric substrate material with conductive pattern elements (split resonator). This composite design integrates the shielding function directly into the PCB structure rather than adding separate metal shielding layers, reducing overall device complexity while achieving effective electromagnetic interference suppression through the resonant absorption characteristics of the composite structure
2Object-affected harmful factors
If thick metal shielding layers are added to absorb electromagnetic waves, then shielding effectiveness is improved, but the device size and weight increase
Solution Approach 1:
The patent changes the shielding mechanism from mass-dependent (thick metal layers) to geometry-dependent (resonator dimensions). The split resonator achieves effective shielding at minimal thickness by utilizing resonant frequencies determined by its geometric parameters (conductor width, spacing, substrate height), eliminating the need for heavy metal shielding layers while maintaining EMI suppression effectiveness
Solution Approach 2:
The patent applies resonance principles where the split resonator structure is designed to vibrate electromagnetically at specific frequencies matching the interfering signals. This resonant vibration enables efficient energy absorption and dissipation in the form of heat, achieving effective shielding with minimal material mass compared to conventional thick metal layer approaches
3Object-affected harmful factors
If multiple conductors and connection portions are added to form split resonators, then electromagnetic shielding effectiveness is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent segments the resonator into multiple conductors (first and second conductors) with connection portions, creating a split resonator structure. This segmentation allows each element to be designed with standardized dimensions that can be precisely manufactured using conventional PCB fabrication techniques, reducing overall manufacturing precision requirements compared to designing a single complex resonator structure
Solution Approach 2:
The patent integrates the split resonator structure directly into the PCB manufacturing process by forming conductors on dielectric substrate layers. This composite approach allows the resonator elements to be created using standard PCB lamination and etching processes, eliminating the need for specialized high-precision manufacturing equipment or techniques, thereby reducing manufacturing precision requirements while achieving effective EMI shielding
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The split resonator effectively reduces electromagnetic interference by absorbing RF signals, improving noise transmission, reflection, and absorption characteristics, particularly at specific frequency bands, thereby preventing signal emission and enhancing device functionality and safety.
Implementation Method 1
one pair of conductors provided in the dielectric substrate, spaced apart from the substrate in a thickness direction of the substrate by a predetermined distance, and arranged to face each other; and a connection portion configured to interconnect the one pair of conductors
Implementation Method 2
a split resonator for absorbing electromagnetic waves generated from a printed circuit board (PCB)
Data Source
AI summary
A split resonator and a printed circuit board (PCB) including the same are disclosed. The split resonator is mounted to one side of the PCB to improve the electromagnetic shielding effect, and absorbs a radiation field emitted to the outer wall of the PCB. The PCB includes: a substrate on which one or more electronic components are populated; a dielectric substrate mounted to one side of the substrate; one pair of conductors provided in the dielectric substrate, spaced apart from the substrate in a thickness direction of the substrate by a predetermined distance, and arranged to face each other; and a connection portion configured to interconnect the one pair of conductors, and arranged in parallel to the thickness direction of the substrate.