Split Sequencing Chip Structure for Small-Volume Reagent Use

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing sequencing chips, such as 8-channel chips, waste reagent solution when used for small-amount sequencing due to unused channels, and cannot be adapted to 4-channel carrier platforms.

Innovation Solution

A chip design with a split structure comprising a first half part and a second half part, where the first half part has a channel and a through hole, and the second half part has a flush, unbroken bottom surface, allowing reagent solution circulation while preventing entry into the second half part, facilitating adaptation to carrier platforms and reducing maintenance costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If an 8-channel chip is used for small-amount sequencing, then the chip can be placed on the carrier platform, but reagent solution is wasted in unused channels

Engineering Contradiction:
Improvechip compatibility with carrier platformVSAvoidreagent solution waste
Core Design Contradiction:
Adaptability or versatilityVSLoss of substance

Solution Approach 1:

The chip is divided into two distinct half parts: a first half part containing functional channels for sequencing reactions, and a second half part with a solid filling structure. This segmentation allows the chip to maintain the physical dimensions needed for carrier platform compatibility while preventing reagent solution from entering non-functional channels, thus eliminating reagent waste.

Inventive Principle:
Principle #1Segmentation

2Loss of substance

If a 4-channel chip is used for small-amount sequencing, then reagent solution is used efficiently, but the chip cannot be placed on the 8-channel carrier platform

Engineering Contradiction:
Improvereagent solution efficiencyVSAvoidchip compatibility with carrier platform
Core Design Contradiction:
Loss of substanceVSAdaptability or versatility

Solution Approach 1:

The chip design provides multi-functionality by enabling a single chip to serve both 8-channel carrier platforms (through its overall dimensions and solid filling structure) and 4-channel sequencing applications (through the functional first half part with channels). The solid filling in the second half part ensures reagent efficiency while the overall chip structure maintains platform compatibility.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Adaptability or versatility

If the first half part and second half part have different bottom surfaces, then the chip structure can accommodate different functions, but anomalies occur during vacuum adsorption on the carrier platform

Engineering Contradiction:
Improvefunctional differentiation between half partsVSAvoidvacuum adsorption stability
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The chip employs local quality by having different internal structures in different regions: the first half part has channels and through holes for sequencing reactions, while the second half part has a solid filling structure. However, both half parts share a common flat bottom surface that ensures uniform vacuum adsorption to the carrier platform, resolving the conflict between functional differentiation and adsorption stability.

Inventive Principle:
Principle #3Local quality

Data Source

PatentEP4674529A1Chip and manufacturing method thereof
Publication Date: 2026.01.07 GENEMIND BIOSCIENCES CO LTD
  • EP4674529A1 patent drawingFigure 1
  • EP4674529A1 patent drawingFigure 2
  • EP4674529A1 patent drawingFigure 3

AI summary

The present application discloses a chip and a manufacturing method thereof. The chip includes a sheet assembly. The sheet assembly includes a first half part and a second half part arranged in parallel with the first half part along a width direction of the chip. The first half part is provided with a first channel; the first half part is provided with a first bottom surface, and a through hole that penetrates through the first bottom surface and communicates with the first channel is formed on the first half part. The second half part is provided with a second bottom surface flush with the first bottom surface. The second bottom surface is a structurally continuous unbroken plane. In this way, a reagent solution can enter the first channel from the through hole and circulate in the first half part of the chip. The bottom surface of the second half part is flush with the bottom surface of the first half part, which can reduce the likelihood of anomalies occurring when the first half part and the second half part are vacuum-adsorbed on the carrier platform. The second bottom surface is a structurally continuous unbroken plane, which can prevent the reagent solution from entering the second half part and serve to fill the chip, realizing the purpose of small-amount sequencing while the chip is adapted to the carrier platform.