Split Stack Triple Height Cell Layout for IC Area Reduction
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Solution Overview
Problem
Manual design of complex integrated circuits with thousands or millions of components is impractical due to the vast number of steps and design information required, necessitating efficient design tools that can handle hierarchical design and reuse of sub-blocks.
Innovation Solution
The implementation of a split stack triple height cell layout scheme, where components of multi-stage circuits are strategically split across multiple rows, allowing for efficient placement and optimization of transistors and interconnects within a standard cell library, using both planar transistor and FinFET technologies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multi-stage circuits are implemented using conventional single-row cell layouts, then design simplicity is maintained, but surface area usage increases and power efficiency deteriorates
Solution Approach 1:
The patent transitions from conventional single-row horizontal layouts to a three-row vertical stacked architecture. Multi-stage circuits are distributed across multiple rows in the vertical dimension, with stages placed in different rows and connected through vertical interconnects. This dimensional change enables compact integration while maintaining design systematicity through standardized row templates and interconnect patterns.
2Area of stationary object
If transistors are densely packed in conventional layouts, then area is reduced, but signal routability and power efficiency worsen
Solution Approach 1:
The patent segments the circuit into multiple stages distributed across different rows. Each stage is contained within or spans specific rows, with clear separation between stages. This segmentation enables independent optimization of each stage's transistor packing while maintaining overall signal routability through dedicated vertical interconnects between rows, preventing signal congestion that would occur in densely packed single-row layouts.
3Productivity
If manual design methods are used for complex circuits with thousands of components, then design precision can be maintained, but time and cost increase dramatically
Solution Approach 1:
The patent segments complex multi-stage circuits into modular units distributed across standardized three-row templates. Each row follows a consistent structure with defined transistor placement patterns and interconnect locations. This segmentation enables automated EDA tools to systematically generate layouts by instantiating and connecting modular stage units, dramatically improving design efficiency while maintaining precision through standardized patterns and automated placement algorithms.
Data Source
AI summary
Split stack triple height cells and methods of generating layouts of same are described herein. The structure includes a circuit formed within three stacked rows. The circuit includes a first stage having a first plurality of electrical components and a second stage having a second plurality of electrical components. The first row includes a first electrical component of the first plurality of electrical components within a top portion of the first row. A first electrical component of the second plurality of electrical components is within a bottom portion of the first row and a top portion of the second row. A second electrical component of the second plurality of electrical components is within a top portion of the third row and a bottom portion of the second row. A second electrical component of the first plurality of electrical components is within a bottom portion of the third row.