Split Vacuum Chamber Sputtering for Large Substrate Patterning
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Solution Overview
Problem
Conventional sputtering apparatuses are cumbersome and expensive, making it impractical to form conductive or resistive patterns on large substrate plates, as they require the plate to fit entirely within the apparatus, which is not feasible for big plates like window panels.
Innovation Solution
A two-part vacuum chamber apparatus with a gap in between, allowing a substrate plate to be placed vertically between the chambers, where one chamber contains a sputtering source and a mask, and the other a substrate surface heater, enabling pattern formation on plates larger than the apparatus' processing area by maintaining equal pressure in both chambers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a conventional sputtering apparatus is used to form patterns on large substrate plates, then the pattern formation quality is maintained, but the apparatus becomes cumbersome and expensive, and cannot accommodate plates larger than the processing area
Solution Approach 1:
The vacuum chamber is divided into two separate parts that can be positioned independently on opposite sides of the substrate plate. The sputtering source is located in one vacuum chamber while the mask is in the other, allowing the substrate plate to extend beyond the processing area while maintaining vacuum conditions for pattern formation.
2Reliability
If the substrate plate is placed entirely within the sputtering apparatus, then proper vacuum conditions are maintained, but the apparatus must be larger and more expensive to accommodate big plates
Solution Approach 1:
The vacuum system is segmented into two separate vacuum chambers positioned on opposite sides of the substrate plate. Each chamber maintains independent vacuum conditions, allowing the substrate plate to span beyond the apparatus boundaries while preserving reliable vacuum environments for sputtering and masking operations.
Solution Approach 2:
The substrate plate itself acts as an intermediary structure that bridges the two separate vacuum chambers. By positioning the plate vertically between the chambers with edges extending outward, it enables simultaneous access to both vacuum environments while supporting the pattern formation process on its surface.
3Ease of manufacture
If traditional lithographic or dispensing methods are used for pattern formation, then the process can be simplified, but the time consumption increases excessively and separate conductive pattern arrangements are needed
Solution Approach 1:
The sputtering source and mask are positioned in separate vacuum chambers on opposite sides of the substrate plate, allowing simultaneous deposition of conductive material through the mask pattern. This merging of sputtering and masking operations in a single integrated process eliminates the need for separate lithographic or dispensing steps, reducing both complexity and time consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and cost-effective pattern formation on large substrate plates, reducing the need for separate conductive pattern arrangements and allowing patterns to extend to the edges, while consuming less process gas and being faster and more compact than traditional methods.
Implementation Method 1
Sputtering is a technique used to deposit thin films of a material onto a surface. By first creating a gaseous plasma and then accelerating the ions from this plasma into some source material, the source material is eroded by the arriving ions via energy transfer and it is ejected in the form of neutral particles
Implementation Method 2
heating the back surface of the substrate plate to be sputtered, the pattern is sputtered on the substrate plate
Data Source
AI summary
The disclosure relates to an apparatus for forming patterns on a surface of a substrate plate by a sputtering process, and the apparatus comprises a first vacuum chamber, a sputtering source inside the first vacuum chamber, and an arrangement to place a mask between the sputtering source and the surface of the substrate plate. The disclosure also relates to a method for forming patterns on a surface of a substrate plate by a sputtering process.