Split Vacuum Chamber Layout for Large Substrate Pattern Coating
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Solution Overview
Problem
Existing sputtering apparatuses are cumbersome and expensive when attempting to apply conductive or resistive patterns on large substrate plates, as they require the plate to fit entirely within the apparatus, leading to potential bending or surface contamination during vacuum processing.
Innovation Solution
An apparatus comprising a first and second vacuum chamber, with a gap to accommodate large substrate plates, where the chambers are configured to maintain equal base pressure and separate during the coating process, allowing for pattern formation without bending and minimizing contamination, using a pump assembly and valve arrangement to control pressure and isolate chambers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the substrate plate is placed entirely within the vacuum chamber for coating, then the coating process can be performed, but the apparatus becomes cumbersome and expensive for large plates
Solution Approach 1:
The vacuum system is segmented into two separate chambers: a first vacuum chamber for roughing and a second vacuum chamber for the actual coating process. This allows the substrate plate to be processed in stages, with only the necessary area exposed to vacuum at any given time, reducing the overall size and complexity of the apparatus.
Solution Approach 2:
The substrate plate is positioned horizontally between the two vacuum chambers rather than vertically within a single chamber. This dimensional change allows the plate to extend beyond the processing area while maintaining vacuum integrity in the active zones.
2Area of stationary object
If the substrate plate is placed between two vacuum chambers, then the plate size can exceed the processing area, but pressure control complexity increases
Solution Approach 1:
The pressure control system is segmented with separate pump assemblies and valve arrangements for each vacuum chamber. This allows independent pressure management in each chamber, simplifying the overall control complexity while enabling processing of larger substrate plates.
Solution Approach 2:
The first vacuum chamber performs preliminary roughing of the substrate plate before it is transferred to or processed in the second vacuum chamber. This preliminary action prepares the substrate for the final coating process, allowing each chamber to operate at optimized pressure levels.
3Reliability
If the vacuum chamber is separated during coating, then contamination is minimized, but the coating process time increases
Solution Approach 1:
The coating process is segmented into distinct phases: roughing in the first chamber, then transferring to or processing in the second chamber. This segmentation allows each chamber to be optimized for its specific function, maintaining surface quality while managing overall process time.
Solution Approach 2:
The substrate plate remains in position between the chambers throughout the process, and the valve arrangements allow continuous operation without complete disassembly or repositioning of the substrate, minimizing idle time between processing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient pattern formation on large substrate plates with reduced risk of bending and contamination, improving manufacturing efficiency for touch-sensitive surfaces and allowing for various coating processes, including sputtering, while maintaining a controlled roughing phase and minimizing gas spread.
Implementation Method 1
a first vacuum chamber, a second vacuum chamber... configured to maintain equal base pressure... allowing for pattern formation without bending and minimizing contamination
Implementation Method 2
sputtering, which is a technique used to deposit thin films of a material onto a surface. By first creating a gaseous plasma and then accelerating the ions from this plasma into some source material, the source material is eroded by the arriving ions via energy transfer and it is ejected in the form of neutral particles
Implementation Method 3
By first creating a gaseous plasma and then accelerating the ions from this plasma into some source material
Data Source
AI summary
An apparatus for forming patterns on a substrate plate is disclosed. The apparatus includes a first vacuum chamber, a second vacuum chamber, a pump assembly and a valve arrangement. The substrate plate is configured to be situated between the vacuum chambers. The first vacuum chamber includes a mask chamber, a processing chamber, and a process valve between the first vacuum chamber and the second vacuum chamber. The side of the substrate plate on which the patterns are to be formed is placed towards the first vacuum chamber and another side faces the second vacuum chamber. The pump assembly and the valve arrangement are configured in such a way that when the coating process is started, the second vacuum chamber and mask chamber are first depressurised and then the first vacuum chamber and the second vacuum chamber are separated. The process valve is opened, and a deep vacuum is produced in the first vacuum chamber.