Split-Via Antenna Integrated PCB for Phased-Array Assembly
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Solution Overview
Problem
Active-array antennas face challenges due to their thickness, high cost, and difficulties in integrating electronics and RF/DC logic distribution networks, especially at frequencies higher than 10 GHz, which limits their use and increases labor costs and potential yield losses in phased-array antenna implementations.
Innovation Solution
The development of an improved antenna integrated printed wiring board (IAiPWB) with a split-via design that allows for vertical orientation of connections, eliminating the need for flexible bends and enabling efficient wire bonding directly in a vertical plane, thus reducing assembly complexity and costs while maintaining proper inter-element spacing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional 90-degree bent electrical connections are used to connect vertical brick module to horizontal AiPWB, then proper lattice spacing of radiating elements can be achieved, but assembly complexity and labor costs increase significantly
Solution Approach 1:
The patent transitions from planar wire bonding to three-dimensional vertical wire bonding through the split-via structure. The via split into two portions at different heights creates vertical separation between connection points, enabling direct vertical wire bonds from the brick module to the AiPWB without requiring 90-degree flexible bends. This dimensional change simplifies the assembly process while maintaining proper radiating element spacing.
2Reliability
If manual wire bonding and conductive epoxy application are used for 90-degree RF connections, then electrical connection between brick module and AiPWB can be established, but assembly costs and potential yield losses increase
Solution Approach 1:
The split-via structure is designed to enable automated wire bonding processes. By providing vertically aligned connection points at different heights, the structure allows automated bonding equipment to create connections without manual intervention. This eliminates the need for manual wire bonding and conductive epoxy application, significantly reducing assembly costs and improving consistency while maintaining reliable electrical connections.
3Ease of operation
If flexible interconnects with 90-degree bends are used to connect vertical and horizontal assemblies, then proper orientation can be achieved, but insertion losses increase
Solution Approach 1:
The patent eliminates the need for 90-degree flexible interconnects by using vertical wire bonds through the split-via structure. The two portions of the via are positioned at different vertical heights, creating direct vertical electrical pathways that avoid the sharp bends required by conventional flexible interconnects. This dimensional arrangement reduces signal degradation and insertion losses while achieving proper assembly orientation.
Data Source
Figure 1
Figure 2
Figure 3A~3B
AI summary
Disclosed is an improved antenna integrated printed wiring board ("IAiPWB"). The IAiPWB includes a printed wiring board ("PWB"), a first radiating element, and a first split-via. The PWB has a bottom surface and the first radiating element is integrated into the PWB. The first radiating element has a first radiator. The first probe is in signal communication with the first radiator and the first split-via, where a portion of the first split-via is integrated into the PWB at the bottom surface.