Split Via Layout for Dense Differential Pair Routing
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Solution Overview
Problem
Conventional via design in semiconductor devices results in significant via land footprints, leading to congested circuit board areas, limited routing spaces, and irregular trace designs, particularly affecting high-speed data transfer and signal integrity.
Innovation Solution
A split via structure is introduced, featuring a pair of half-moon shaped vias with via lands disposed within a circular region, allowing for differential pair traces to be aligned in parallel and reducing via land footprints, thereby optimizing trace length matching and enabling tighter routing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional via design is used, then via lands can accommodate overlap tolerances with metal contacts, but via land footprints become significant and occupy substantial surface area on the circuit board
Solution Approach 1:
The via land is segmented into multiple regions: a first via land region for the first via, a second via land region for the second via, and a shared third via land region. This segmentation allows each via to have its own dedicated landing area while sharing common infrastructure, reducing the total footprint compared to conventional separate via lands.
Solution Approach 2:
The patent merges the via land structures by having multiple vias share a common third via land region. Instead of providing separate via lands for each via, the design combines them into a shared infrastructure that accommodates multiple vias within a smaller overall footprint while still maintaining the necessary overlap tolerances for metal contacts.
2Area of stationary object
If multiple vias are placed closely together, then surface area is reduced, but routing spaces become limited and trace designs become irregular
Solution Approach 1:
The via land is segmented into multiple regions: a first via land region for the first via, a second via land region for the second via, and a shared third via land region. This segmentation allows each via to have its own dedicated landing area while sharing common infrastructure, reducing the total footprint compared to conventional separate via lands.
3Area of stationary object
If via lands are reduced in size, then surface area is optimized, but trace length matching and signal integrity become more difficult to maintain
Solution Approach 1:
The via land structure provides different qualities in different regions: the first and second via land regions provide localized support for their respective vias with appropriate overlap tolerances, while the shared third via land region provides common infrastructure. This local differentiation maintains signal integrity for each via while optimizing the overall footprint.
Data Source
AI summary
A semiconductor device assembly including a substrate; a first split via including a first via land that is disposed on a surface of the substrate and that has a first footprint with a half-moon shape with a first radius of curvature, and a first via that passes through the substrate and that has a second radius of curvature, wherein the first via is disposed within the first footprint; and a second split via including a second via land that is disposed on the surface of the substrate and that has a second footprint with the half-moon shape with the first radius of curvature, and a second via that passes through the substrate and that has the second radius of curvature, wherein the second via is disposed within the second footprint, wherein the first and second via lands are disposed entirely within a circular region having the first radius of curvature.