Split Polymer Optical Waveguide Stacking for Dense PIC Interconnects
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Solution Overview
Problem
Integrating optics with silicon photonics chips (PICs) is challenging due to size limitations of optical interconnects, which hinders high throughput and intra- and inter-system bandwidth requirements in data centers and high-performance computers.
Innovation Solution
A scalable method for integrating a single mode polymer optical waveguide (POW) technology, utilizing a flexible waveguide with a bifurcated end and a ferrule module that allows for stacking and folding configurations to increase the density of waveguide cores connected to the photonics chip, potentially reducing the number of ferrules and bending stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional optical interconnects are used, then integration with silicon photonics chips is achieved, but the size limitations hinder high throughput and bandwidth requirements
Solution Approach 1:
The patent transitions from planar integration to three-dimensional stacking by folding the waveguide ribbon back over itself multiple times, creating vertical layers that increase bandwidth without increasing footprint area. The waveguide is folded into a compact three-dimensional structure that maintains high throughput while solving the size limitation.
Solution Approach 2:
The waveguide ribbon is nested within itself through multiple folds, with each fold containing previous folds within its structure. This nested configuration allows multiple waveguide paths to occupy the same spatial volume, increasing throughput capacity without proportionally increasing the overall device size.
2Reliability
If multiple ferrules are used to connect waveguide cores, then connection reliability is improved, but device complexity and manufacturing steps increase
Solution Approach 1:
The patent merges multiple individual ferrule connections into a single integrated ferrule structure that accommodates multiple waveguide cores simultaneously. This unified ferrule design maintains connection reliability for multiple waveguide paths while eliminating the complexity of assembling and aligning multiple separate ferrules.
Solution Approach 2:
The ferrule structure is designed with multi-functionality, serving as both the connection interface and the structural support for multiple waveguide cores. This universal design reduces the number of discrete components needed while maintaining reliable optical connections for high-throughput applications.
3Quantity of substance
If waveguide ribbon is folded multiple times, then density of waveguide cores is increased, but bending stress increases
Solution Approach 1:
The patent optimizes the geometric parameters of the folded waveguide structure, including fold radius, layer spacing, and ribbon thickness, to maximize waveguide core density while minimizing bending stress. By carefully controlling these parameters, the design achieves high density without excessive stress that would compromise optical performance.
Data Source
AI summary
A device includes a photonics chip and a flexible waveguide having a first end connected to the photonics chip and a second end opposite the first end, in which the second end of the flexible waveguide includes a first portion connected to a ferrule module and a second portion connected to the ferrule module. The second portion is stacked vertically over the first portion in the ferrule module.