SPM Flow Rate Calibration for Uniform Substrate Processing Temperature

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Solution Overview

Problem

Variations in temperature of the SPM liquid among multiple liquid processors in a substrate processing apparatus lead to variations in processing results, necessitating a technique to adjust the flow rate of sulfuric acid before it is mixed into the SPM liquid.

Innovation Solution

The method involves discharging the SPM liquid under multiple discharge conditions from selected liquid processors, measuring the temperature of the SPM liquid using temperature sensors, obtaining a correlation function between the temperature and the sulfuric acid flow rate, generating a relational expression for consistent temperature conditions, and adjusting the sulfuric acid flow rate in the second liquid processor using this expression.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If multiple liquid processors supply SPM liquid to substrates, then processing capacity is improved, but temperature variations among processors cause processing result variations

Engineering Contradiction:
Improveprocessing capacityVSAvoidprocessing result consistency
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The system changes the flow rate parameter of sulfuric acid dynamically based on measured temperature variations. By adjusting the sulfuric acid flow rate in response to temperature deviations, the system compensates for thermal variations and maintains consistent processing results across multiple liquid processors

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The system implements a feedback mechanism where temperature sensors continuously monitor the SPM liquid temperature in each processor, and the control device uses this feedback information to automatically adjust sulfuric acid flow rates. This closed-loop control ensures that temperature variations are detected and corrected in real-time, maintaining processing consistency

Inventive Principle:
Principle #23Feedback

2Ease of operation

If temperature of SPM liquid is not controlled, then operation is simple, but processing results vary due to temperature differences

Engineering Contradiction:
Improveoperation simplicityVSAvoidprocessing result consistency
Core Design Contradiction:
Ease of operationVSManufacturing precision

Solution Approach 1:

The system enables self-service temperature compensation by automatically measuring temperatures and adjusting sulfuric acid flow rates without manual intervention. The control device autonomously manages the temperature compensation process, maintaining processing consistency while keeping the operation simple for users

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The system automatically changes the sulfuric acid flow rate parameter based on measured temperature conditions, eliminating the need for manual temperature control operations while ensuring consistent processing results across different processors

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach prevents variations in the temperature of the SPM liquid among multiple liquid processors, thereby stabilizing processing results across all processors.

Implementation Method 1

measuring a temperature of the mixed liquid for each of the plurality of discharge conditions by using a temperature sensor provided in each of the first liquid processor and the second liquid processor

Methodology Applied
Scientific EffectTemperature sensing: Thermocouple

Data Source

PatentUS20250025908A1Flow rate adjustment method in substrate processing apparatus and substrate processing apparatus
Publication Date: 2025.01.23 TOKYO ELECTRON LTD
  • US20250025908A1 patent drawing
  • US20250025908A1 patent drawing
  • US20250025908A1 patent drawing

AI summary

A flow rate adjustment method in a substrate processing apparatus including liquid processors performing liquid processing by supplying a mixed liquid of sulfuric acid and hydrogen peroxide to a substrate includes: discharging the mixed liquid under each discharge condition from first and second liquid processors; measuring a temperature of the mixed liquid for each discharge condition in the first and second liquid processors respectively; obtaining a correlation function between the temperature of the mixed liquid and a flow rate of sulfuric acid included in each discharge condition for the first and second liquid processors and thus generating a relational expression illustrating a sulfuric acid flow rate relationship when the temperature of the mixed liquid is identical between the first and second liquid processors; and adjusting the flow rate of sulfuric acid before being mixed into the mixed liquid in the second liquid processor by using the relational expression.