SPM Liquid Temperature Control in Substrate Processing
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Solution Overview
Problem
Existing substrate processing systems face challenges in accurately supplying a Sulfuric Acid Hydrogen Peroxide Mixture (SPM) liquid at the required temperature, especially when processing conditions such as substrate rotation, gas exhaust rate, or sulfuric acid concentration are changed.
Innovation Solution
A substrate processing apparatus with a temperature adjusting unit that adjusts the SPM liquid temperature based on real-time temperature information acquired from the substrate surface, using a control unit to set the adjustment amount, ensuring precise temperature control during SPM liquid supply.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If operational conditions are determined through experiment, then the system is simple to operate, but the temperature control accuracy deteriorates when processing conditions change
Solution Approach 1:
The patent implements a feedback control system where a temperature detection unit continuously monitors the actual temperature of the SPM liquid, and the control unit adjusts the heater's operational conditions based on the difference between the detected temperature and the target temperature. This closed-loop feedback mechanism ensures high temperature control accuracy even when processing conditions change, resolving the contradiction between precision and complexity.
Solution Approach 2:
The system automatically adjusts its own operational parameters through the feedback control mechanism without requiring manual intervention. The control unit self-regulates the heater's power consumption based on real-time temperature measurements, enabling the system to maintain optimal temperature control accuracy while adapting to changing processing conditions autonomously.
2Reliability
If heater operational conditions are fixed based on experimental relationships, then the device is easy to manufacture, but the reliability of temperature control worsens when processing conditions change
Solution Approach 1:
The patent transforms the static, fixed heater operational conditions into dynamic, adjustable parameters. The control unit continuously modifies the heater's power consumption based on real-time feedback from the temperature detection unit, allowing the system to adapt to changing processing conditions such as substrate rotation speed, gas exhaust rate, and sulfuric acid concentration. This dynamic adjustment mechanism ensures reliable temperature control without requiring complex manual calibration for each processing condition change.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables more accurate processing with the SPM liquid at the required temperature, improving the effectiveness of resist film removal and substrate processing.
Implementation Method 1
a temperature adjustment of sulfuric acid through a heater provided in a sulfuric acid supply path
Implementation Method 2
generate a SPM liquid by mixing sulfuric acid and hydrogen peroxide
Data Source
AI summary
A substrate processing apparatus includes a processing liquid supply mechanism 70 configured to supply a SPM liquid to a substrate; a temperature adjusting unit (heater) 303 configured to adjust a temperature of the SPM liquid at a time when the SPM liquid is supplied to the substrate from the processing liquid supply mechanism 70; an acquisition unit (temperature sensor) 80 configured to acquire temperature information of the SPM liquid on a surface of the substrate; and a control unit 18 configured to set an adjustment amount of the temperature adjusting unit (heater) 303 based on the temperature information of the SPM liquid acquired by the acquisition unit (temperature sensor) 80. The temperature adjusting unit (heater) 303 adjusts, based on the adjustment amount set by the control unit 18, the temperature of the SPM liquid at the time when the SPM liquid is supplied to the substrate.