SPM Mixing Nozzle for Stable Resist Removal Heating
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Solution Overview
Problem
Current substrate processing techniques face challenges in efficiently removing resist films during the SPM process due to issues with temperature stability and hardware load when heating sulfuric acid, leading to fuming and bumping problems.
Innovation Solution
A substrate processing apparatus that mixes pressurized vapor of purified water with sulfuric acid hydrogen peroxide mixture, using a nozzle with a guiding route to efficiently discharge the mixture and prevent diffusion, thereby improving temperature control and reducing contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If sulfuric acid is heated to raise temperature for resist film removal, then removal efficiency is improved, but hardware load increases and temperature stability deteriorates causing fuming and bumping
Solution Approach 1:
The patent introduces an intermediary substance (processing liquid containing sulfuric acid and hydrogen peroxide in specific ratios) that mediates between the heating process and the resist film. This intermediary formulation allows temperature elevation to improve removal efficiency while the specific composition prevents fuming and bumping, thereby maintaining temperature stability and reducing hardware load.
2Productivity
If sulfuric acid concentration is increased to improve removal efficiency, then productivity increases, but harmful factors increase due to fuming and contamination
Solution Approach 1:
The patent applies parameter changes by precisely controlling the concentration ratios of sulfuric acid and hydrogen peroxide in the processing liquid. By optimizing these parameters (specific acid concentration and配比), the invention achieves high removal efficiency while minimizing harmful effects such as fuming and contamination, thus resolving the contradiction between productivity and harmful factors.
3Productivity
If heating power is increased to raise processing liquid temperature, then removal efficiency is improved, but energy consumption increases and temperature control becomes difficult
Solution Approach 1:
The patent changes the chemical composition parameters of the processing liquid (adding hydrogen peroxide to sulfuric acid in specific ratios) to reduce the heating energy required. This compositional modification allows the liquid to achieve effective removal efficiency at lower temperatures, thereby reducing energy consumption and improving temperature controllability while maintaining high productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the removal efficiency of resist films by effectively raising the temperature of the SPM liquid while minimizing contamination and hardware load, ensuring stable and efficient processing.
Implementation Method 1
mixes pressurized vapor of purified water with sulfuric acid hydrogen peroxide mixture, effectively raising the temperature of the SPM liquid
Implementation Method 2
The nozzle is connected to the fluid supply unit and the processing liquid supply unit, mixes a fluid and a processing liquid
Data Source
AI summary
A substrate processing apparatus includes a fluid supply unit that supplies a fluid that includes a pressurized vapor or mist of a purified water, a processing liquid supply unit that supplies a processing liquid that includes at least sulfuric acid, and a nozzle that includes a first discharge port that discharges a fluid that is supplied from the fluid supply unit, a second discharge port that discharges a processing liquid that is supplied from the processing liquid supply unit, and a guiding route that is communicated with the first discharge port and the second discharge port and guides a mixed fluid of a fluid that is discharged from the first discharge port and a processing liquid that is discharged from the second discharge port, where a cross-sectional area of the guiding route is greater than a cross-sectional area of the first discharge port.