SPM Mixing Layout for Low-Chemical Resist Stripping
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Solution Overview
Problem
The existing substrate processing methods for semiconductor manufacturing, which use a sulfuric acid hydrogen peroxide mixture (SPM) for resist stripping, require high temperatures and result in excessive consumption of chemical liquids, posing environmental concerns.
Innovation Solution
A substrate processing apparatus that generates a third processing liquid by mixing a sulfuric acid and a hydrogen peroxide solution at multiple mixing positions along a supply path, with the mixing starting at the farthest position from the discharge port and finishing at the closest position, to efficiently promote chemical reactions and reduce chemical liquid consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a sulfuric acid and hydrogen peroxide solution are mixed to generate SPM liquid at high temperature, then the resist stripping ability is sufficiently utilized, but the consumption of chemical liquid increases and environmental harm worsens
Solution Approach 1:
The patent divides the single mixing process into multiple sequential mixing stages. The sulfuric acid and hydrogen peroxide solution are mixed at multiple positions along the flow path, creating intermediate mixing zones. This segmentation allows the reaction to progress in steps, improving reaction efficiency and reducing the total amount of chemical liquid needed while maintaining the required temperature for effective resist stripping.
Solution Approach 2:
The patent implements preliminary heating of the sulfuric acid before mixing with hydrogen peroxide solution. By pre-heating the sulfuric acid to the required temperature range (160°C or higher) before the mixing occurs, the system ensures that the exothermic reaction maintains optimal temperature for resist stripping without requiring excessive chemical liquid volumes, thus reducing overall consumption.
2Productivity
If a sufficient amount of hydrogen peroxide solution is used to promote the first chemical reaction, then the resist stripping process is effective, but the environmental harm increases
Solution Approach 1:
The patent segments the hydrogen peroxide solution addition into multiple stages at different mixing positions along the flow path. Instead of adding all hydrogen peroxide at once, it is introduced progressively through multiple second supply paths connected at different positions. This segmented approach improves reaction efficiency by maintaining optimal local concentrations while reducing the total volume of chemical liquid required, thereby decreasing environmental harm.
Solution Approach 2:
The patent changes the parameters of the mixing process by controlling the flow rates and mixing positions of hydrogen peroxide solution addition. By adjusting these parameters across multiple mixing stages, the system achieves high productivity with reduced chemical consumption. The sequential mixing allows better control of reaction kinetics, improving resist stripping efficiency while minimizing the total amount of hydrogen peroxide needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively reduces the consumption of chemical liquids while maintaining efficient resist stripping, thereby addressing environmental concerns and improving processing efficiency.
Implementation Method 1
The chemical reaction in which the SPM liquid is generated using a sulfuric acid and a hydrogen peroxide solution is an exothermic reaction
Implementation Method 2
The SPM liquid is supplied to the substrate, so that the resist film formed on the substrate is removed
Data Source
AI summary
A substrate processing apparatus that generates a third processing liquid using a first processing liquid and a second processing liquid, include a first supply path connected to a discharge port, a plurality of second supply paths respectively connected to the first supply path at a plurality of mixing positions having different flow-path lengths to the discharge port, a first supplier that supplies the first processing liquid to the first supply path, and a second supplier that supplies the second processing liquid to the first supply path through the plurality of second supply paths, wherein at the plurality of mixing positions of the first supply path, liquid in the first supply path is sequentially mixed with the second processing liquid, with mixing starting at the mixing position that is the farthest from the discharge port and finishing at the mixing position that is the closest from the discharge port.