Scanning Probe Microscopy Tip Fabrication via Dry Etching

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Solution Overview

Problem

Current methods for producing scanning probe microscopy (SPM) tips are not capable of producing high-density, extremely sharp tips suitable for large-scale industrial applications, such as semiconductor production, due to limitations in reproducibility, material selectivity, and complexity of the fabrication process.

Innovation Solution

A method involving underetching beneath hardmasks on a substrate to form pre-tip structures, followed by vertical etching to create pedestals, selective removal of hardmasks, and thinning of the neck region to detach the tips, allowing for the fabrication of high-density, sharp SPM tips using a dry etching technique.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional tip production methods are used, then tips can be produced, but they cannot achieve high density and extreme sharpness required for large-scale industrial applications

Engineering Contradiction:
Improvetip sharpness and uniformityVSAvoidtip production density and scale
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The substrate is divided into multiple identical pre-tip structures arranged in an array, where each structure is processed independently through the same fabrication steps. This segmentation allows parallel processing of many tips simultaneously, achieving high production density while maintaining consistent sharpness and uniformity across all tips through standardized fabrication procedures

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The fabrication process utilizes controlled parameter changes during dry etching, including adjusting etch depth, etch rate, and plasma conditions, to precisely shape the tip apex and achieve extreme sharpness. By optimizing these parameters, the method produces uniformly sharp tips across the entire substrate array, enabling both high precision and high productivity

Inventive Principle:
Principle #35Parameter changes

2Ease of manufacture

If existing fabrication methods are used, then tips can be produced, but the process is complex and not suitable for large-scale production

Engineering Contradiction:
Improvefabrication process simplicityVSAvoidindustrial-scale production capability
Core Design Contradiction:
Ease of manufactureVSProductivity

Solution Approach 1:

Multiple fabrication steps are merged into a single integrated dry etching process that simultaneously forms the pedestal, neck, and tip apex in one continuous operation. This consolidation simplifies the manufacturing process by eliminating the need for multiple separate etching steps and intermediate handling, making the process suitable for industrial-scale production while maintaining ease of manufacture

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The method performs preliminary actions by first forming the hardmask pattern and then using it as a template for the entire tip fabrication process. The hardmask defines the tip location and geometry before any material removal occurs, streamlining subsequent processing steps and enabling straightforward scaling to industrial production volumes

Inventive Principle:
Principle #10Preliminary action

3Productivity

If high-density tip arrays are produced, then productivity increases, but manufacturing precision and uniformity become difficult to maintain

Engineering Contradiction:
Improvetip density on substrateVSAvoidtip uniformity across array
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

A single fabrication process is designed to universally produce all tips across the entire substrate array simultaneously. The dry etching parameters and hardmask pattern are optimized to ensure that every tip, regardless of its position in the high-density array, receives identical processing conditions, thereby maintaining uniformity and manufacturing precision across all tips while achieving high production density

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables the efficient and reproducible fabrication of high-density, sharp SPM tips with high uniformity, suitable for large-scale industrial applications, while reducing processing time and costs, and allowing for the use of conventional lithography equipment.

Implementation Method 1

a. underetching beneath one or more hardmasks, each having rotational symmetry, present on a substrate, thereby forming a corresponding number of pre-tip structures

Methodology Applied
Scientific EffectDry etching:

Data Source

PatentUS20250067771A1Method For Producing A Substrate Comprising Scanning Probe Microscopy Tips
Publication Date: 2025.02.27 INTERUNIVERSITAIR MICRO ELECTRONICS CENT (IMEC VZW)
  • US20250067771A1 patent drawing
  • US20250067771A1 patent drawing
  • US20250067771A1 patent drawing

AI summary

A method is provided for fabricating a substrate comprising on its surface one or more scanning probe microscopy tips, the method including: a) underetching beneath one or more hardmasks, each having rotational symmetry, present on a substrate, thereby forming a corresponding number of pre-tip structures having an upper part, a lower part, and a neck region linking the upper part to the lower part; b) then, etching the substrate underneath each pre-tip structure in a vertical manner using the respective hardmask as an etching mask, thereby forming a pedestal beneath the lower part of each pre-tip structure; c) then, selectively removing the hardmask from each structure; d) then, thinning down the neck until the upper part is physically detached from the lower part, thereby forming the substrate comprising on its surface the one or more scanning probe microscopy tips.